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SN54152W

Texas Instruments

SN54152W by Texas Instruments

The Texas Instruments SN54152W is an 8-input TTL multiplexer in a ceramic flatpack package. Operating temperature range from -55°C to 125°C makes it suitable for military-grade applications. With surface mount capability and dual terminal position, it offers versatile integration options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,849 parts In-Stock

1+ parts

-

100+ parts

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6,849

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Digiode

USA . 404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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404

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 812 parts In-Stock

1+ parts

$9.000

100+ parts

-

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812

$9.000

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AZTECH Wire

Italy . 256 parts In-Stock

1+ parts

$14.109

100+ parts

-

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256

$14.109

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Parana Technologies

USA . 513 parts In-Stock

1+ parts

$26.629

100+ parts

-

1k+ parts

$27.189

10k+ parts

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513

$26.629

-

$27.189

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DigiPath Technology Company

USA . 1,780 parts In-Stock

1+ parts

$29.322

100+ parts

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10k+ parts

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1,780

$29.322

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ChromeModa Solutions

Germany . 2,566 parts In-Stock

1+ parts

$29.920

100+ parts

$24.534

1k+ parts

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10k+ parts

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2,566

$29.920

$24.534

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IDEA Electronic Components Group

UK . 251 parts In-Stock

1+ parts

$29.920

100+ parts

$28.424

1k+ parts

$26.928

10k+ parts

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251

$29.920

$28.424

$26.928

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Corphita

USA . 4,663 parts In-Stock

1+ parts

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4,663

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Overview

Unlock endless possibilities with the SN54152W from Texas Instruments, a leading manufacturer known for top-quality electronic components. This versatile multiplexer & demultiplexer offers seamless operation in a wide range of applications, ensuring reliable performance every time. With its durable ceramic package and military-grade temperature grade, this product is built to last even in the harshest environments. Experience the value and benefits of this product today and take your projects to the next level effortlessly.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and mechanical strength, making it ideal for high temperature applications.

Surface Mount: YES

Surface mount technology allows for easy and reliable installation on circuit boards, saving space and reducing assembly time.

No. of Inputs: 8

Having 8 inputs allows for the multiplexing or demultiplexing of multiple data streams or signals, increasing the flexibility and functionality of the device.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor, making it easy to integrate into electronic systems with limited space.

No. of Terminals: 14

Having 14 terminals allows for easy connection to other components or devices, enabling seamless integration into a larger system.

Package Style (Meter): FLATPACK

Flatpack style offers a low profile design, which can be advantageous in applications where space constraints are a concern.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this device can withstand harsh environmental conditions and operate reliably over a wide range of temperatures.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures that the device can function even in cold environments without any issues.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connection, enhancing the overall reliability and performance of the product.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures that the device can operate in rugged conditions, making it suitable for demanding applications.

Technology: TTL

Utilizing TTL technology ensures fast signal processing with low power consumption, making this device efficient and reliable in data transmission applications.

Terminal Form: FLAT

Flat terminal form facilitates easy soldering and connection, ensuring a stable and durable electrical connection.

Terminal Pitch: 1.27 mm

With a small terminal pitch, this device offers high-density packaging, allowing for the integration of multiple components in a limited space.

Technical Specifications

Multiplexer & Demultiplexer SN54152W attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F14

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN54152W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-242-2721, 5962002422721

NIIN

002422721

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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