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SN74F151N

Texas Instruments

SN74F151N by Texas Instruments

SN74F151N by Texas Instruments is an 8-input multiplexer with a propagation delay of 12 ns at 5V. It features a 3-STATE output and operates within a temperature range of 0 to 70°C. This TTL technology device has through-hole terminals and is commonly used in commercial applications requiring signal multiplexing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 4,634 parts In-Stock

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Vyrian

USA . 1,967 parts In-Stock

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AZTECH Wire

Italy . 272 parts In-Stock

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$9.141

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One Stop Electronics

USA . 1,601 parts In-Stock

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$17.000

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Parana Technologies

USA . 1,879 parts In-Stock

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$22.269

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$22.940

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DigiPath Technology Company

USA . 271 parts In-Stock

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$24.521

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ChromeModa Solutions

Germany . 3,100 parts In-Stock

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$25.021

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$20.517

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IDEA Electronic Components Group

UK . 488 parts In-Stock

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$25.021

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$23.770

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$22.519

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Corphita

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Overview

Enhance your electronic projects with the SN74F151N by Texas Instruments, a high-quality multiplexer & demultiplexer component that offers exceptional performance and reliability. Manufactured by industry leader Texas Instruments, this versatile product features 8 inputs and a fast propagation delay of 12ns, making it perfect for a wide range of applications. With a nominal supply voltage of 5V and a maximum power supply current of 21mA, the SN74F151N provides excellent value and benefits to customers looking for a reliable solution for their electronics projects. Elevate your designs with the SN74F151N and experience the quality and precision that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer & demultiplexer.

No. of Inputs: 8

Having 8 inputs allows for versatile connectivity options and the ability to handle multiple input signals simultaneously.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration into existing systems easy and reduces the need for additional power conversion.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance state, which can be useful for bus contention situations or when the output needs to be disconnected from the rest of the circuit.

Technology: TTL

Using TTL technology ensures compatibility with other TTL logic devices and provides reliable signal processing and communication within the system.

Technical Specifications

Multiplexer & Demultiplexer SN74F151N attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

21 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74F151N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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