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74LVC257ADB

NXP Semiconductors

74LVC257ADB by NXP Semiconductors

NXP Semiconductors' 74LVC257ADB is a CMOS multiplexer with 4 functions, 2 inputs, and 3.3V power supply. It features a propagation delay of 5.1ns at nominal voltage, operates in the temperature range of -40 to 125°C, and has a small outline package suitable for automotive applications.

Median Price

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Lifecycle Status

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In-Stock Inventory

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AZTECH Wire

Italy . 10,674 parts In-Stock

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Ampacity Inc.

Singapore . 1,093 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

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Overview

Elevate your electronic designs with the 74LVC257ADB by NXP Semiconductors, a high-quality multiplexer & demultiplexer that offers unmatched performance and reliability. Manufactured with precision and expertise, this versatile component is designed to streamline circuitry while maximizing efficiency. Whether you're working on automotive applications or IoT devices, this compact solution provides seamless integration, rapid response times, and consistent output characteristics. Unlock the potential of your projects with the 74LVC257ADB and experience the difference of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material makes the product lightweight and durable, ideal for various applications.

Propagation Delay at Nominal Supply: 5.1 ns

The low propagation delay ensures efficient and fast signal processing in the multiplexer/demultiplexer.

Surface Mount: YES

The surface mount feature enables easy and convenient PCB assembly, saving time and effort during installation.

No. of Functions: 4

Having 4 functions in one device increases versatility and functionality, reducing the need for multiple components.

Nominal Supply Voltage / Vsup (V): 2.7

The 2.7V supply voltage is within a common range, making it compatible with a wide range of systems and devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the overall performance and efficiency of the product.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures reliable operation in harsh environmental conditions, making it suitable for automotive and industrial applications.

Technical Specifications

Multiplexer & Demultiplexer 74LVC257ADB attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.1 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74LVC257ADB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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