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SN74HC253D-00R

Texas Instruments

SN74HC253D-00R by Texas Instruments

SN74HC253D-00R by Texas Instruments is a dual 4-input multiplexer with a propagation delay of 59ns. Operating at temperatures from -40 to 85°C, it has a supply voltage range of 2-6V and load capacitance of 150pF. Ideal for industrial applications requiring high-speed signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,517 parts In-Stock

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Digiode

USA . 920 parts In-Stock

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920

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Distributors (Availability)

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Parana Technologies

USA . 160 parts In-Stock

1+ parts

$7.464

100+ parts

-

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$7.952

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160

$7.464

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$7.952

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DigiPath Technology Company

USA . 1,594 parts In-Stock

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$8.218

100+ parts

$7.561

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1,594

$8.218

$7.561

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ChromeModa Solutions

Germany . 4,940 parts In-Stock

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$8.386

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$6.877

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4,940

$8.386

$6.877

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IDEA Electronic Components Group

UK . 1,740 parts In-Stock

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$8.386

100+ parts

$7.967

1k+ parts

$7.547

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1,740

$8.386

$7.967

$7.547

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AZTECH Wire

Italy . 346 parts In-Stock

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$19.759

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346

$19.759

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One Stop Electronics

USA . 795 parts In-Stock

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$62.000

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795

$62.000

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Corphita

USA . 1,421 parts In-Stock

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Overview

Upgrade your electronics projects with the SN74HC253D-00R by Texas Instruments, a high-quality multiplexer & demultiplexer that offers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this product is designed to meet the demands of industrial applications while providing customers with exceptional value and benefits. With dual functions, 4 inputs, and a fast propagation delay of 59 ns, this versatile component is perfect for a wide range of circuit designs. Trust Texas Instruments for cutting-edge technology and superior quality components for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

No. of Functions: 2

Provides versatility and flexibility in signal routing and processing.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power sources, making it easy to incorporate into existing systems.

Propagation Delay (tpd): 59 ns

Offers fast signal processing, reducing lag and improving overall system performance.

Maximum Operating Temperature: 85 °C

Withstands high temperature environments, making it suitable for a wide range of applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient operation.

Technical Specifications

Multiplexer & Demultiplexer SN74HC253D-00R attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

59 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

SN74HC253D-00R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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