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5962-8970801EX

Texas Instruments

5962-8970801EX by Texas Instruments

The Texas Instruments 5962-8970801EX is a MILITARY-grade CMOS Multiplexer & Demultiplexer with 4 functions, 2 inputs, and 16 terminals. It has a propagation delay of 41 ns at 5V supply voltage, making it ideal for applications requiring fast signal switching in harsh environments. The package body material is CERAMIC, GLASS-SEALED for durability at temperatures ranging from -55 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,747 parts In-Stock

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Digiode

USA . 1,835 parts In-Stock

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Native Components

USA . 57 parts In-Stock

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$2.123

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57

$2.123

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Northwest PG Solutions

USA . 1,909 parts In-Stock

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$2.336

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AZTECH Wire

Italy . 685 parts In-Stock

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$8.038

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$8.038

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Parana Technologies

USA . 1,095 parts In-Stock

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$25.413

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$26.040

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$25.413

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DigiPath Technology Company

USA . 76 parts In-Stock

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$27.983

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$25.744

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76

$27.983

$25.744

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ChromeModa Solutions

Germany . 4,009 parts In-Stock

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$28.554

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$23.414

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$28.554

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IDEA Electronic Components Group

UK . 1,793 parts In-Stock

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$28.554

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$27.126

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$25.699

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One Stop Electronics

USA . 1,598 parts In-Stock

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$55.000

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Supply Digital

USA . 2,052 parts In-Stock

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Corphita

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Overview

Elevate your electronic systems with the 5962-8970801EX by Texas Instruments. Crafted with precision and expertise, this multiplexer & demultiplexer device offers unparalleled quality and reliability that only a trusted manufacturer like Texas Instruments can provide. Perfect for a wide range of applications, this product boasts fast propagation delay, multiple functions, and military-grade screening level for maximum performance in demanding environments. Discover the value of efficiency, versatility, and innovation with the 5962-8970801EX - the ultimate choice for your electronic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection, making the product ideal for rugged environments.

Propagation Delay At Nominal Supply: 47 ns

The low propagation delay ensures fast processing and efficient operation.

No. of Functions: 4

The multiplexer/demultiplexer can handle multiple functions simultaneously, increasing flexibility and functionality.

Screening Level: MIL-STD-883

Compliance with military screening standards ensures reliability and quality performance.

Nominal Supply Voltage / Vsup (V): 5

The product operates at a standard voltage, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for use in harsh conditions without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer 5962-8970801EX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-GDIP-T16

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

47 ns

Propagation Delay (tpd):

41 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-8970801EX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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