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SN54S151W-00

Texas Instruments

SN54S151W-00 by Texas Instruments

SN54S151W-00 by Texas Instruments is an 8-input TTL multiplexer with a propagation delay of 18ns. It operates in a temperature range from -55 to 125°C, making it suitable for military-grade applications. This flatpack IC has a supply voltage range of 4.5V to 5.5V and a max power supply current of 70mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,269 parts In-Stock

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4,269

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Vyrian

USA . 2,794 parts In-Stock

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2,794

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Distributors (Availability)

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AZTECH Wire

Italy . 380 parts In-Stock

1+ parts

$6.250

100+ parts

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380

$6.250

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Parana Technologies

USA . 611 parts In-Stock

1+ parts

$9.501

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-

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$10.103

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611

$9.501

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$10.103

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DigiPath Technology Company

USA . 836 parts In-Stock

1+ parts

$10.462

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836

$10.462

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ChromeModa Solutions

Germany . 4,457 parts In-Stock

1+ parts

$10.675

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$8.754

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4,457

$10.675

$8.754

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IDEA Electronic Components Group

UK . 1,750 parts In-Stock

1+ parts

$10.675

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$10.141

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$9.608

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1,750

$10.675

$10.141

$9.608

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One Stop Electronics

USA . 1,532 parts In-Stock

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$30.000

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1,532

$30.000

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Corphita

USA . 4,123 parts In-Stock

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4,123

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Overview

Experience unparalleled quality and reliability with the SN54S151W-00 by Texas Instruments, a leading manufacturer in the industry. This multiplexer & demultiplexer offers unmatched performance and versatility for a wide range of applications. With its ceramic, glass-sealed package body material and military-grade temperature grade, this product ensures durability and stability under extreme conditions. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations, providing you with the value, benefits, and advantages you need to succeed. Choose excellence, choose the SN54S151W-00.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides excellent durability and protection for the internal components, ensuring long-term reliability.

No. of Inputs: 8

Having 8 inputs allows for versatile input signal combinations, making this multiplexer/demultiplexer suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with common power sources and makes integration into existing systems easier.

Propagation Delay (tpd): 18 ns

The low propagation delay of 18 ns enables fast switching between input signals, making this multiplexer/demultiplexer suitable for time-critical applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this multiplexer/demultiplexer can operate reliably in harsh environmental conditions.

Technical Specifications

Multiplexer & Demultiplexer SN54S151W-00 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

70 mA

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.73 mm

Trade Compliance

SN54S151W-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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