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M38510/30901B2X

Texas Instruments

M38510/30901B2X by Texas Instruments

M38510/30901B2X by Texas Instruments is a MILITARY-grade TTL Multiplexer with 8 inputs, 56 ns propagation delay, and operates b/w -55 to 125 °C. It comes in a CHIP CARRIER package style and has a supply voltage range of 4.5V to 5.5V. Ideal for military applications requiring fast signal switching in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,974 parts In-Stock

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Digiode

USA . 4,249 parts In-Stock

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Anansix

USA . 2,060 parts In-Stock

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Parana Technologies

USA . 1,942 parts In-Stock

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$11.693

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$12.082

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DigiPath Technology Company

USA . 666 parts In-Stock

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$12.875

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$11.845

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666

$12.875

$11.845

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ChromeModa Solutions

Germany . 5,016 parts In-Stock

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$13.138

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$10.773

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IDEA Electronic Components Group

UK . 1,062 parts In-Stock

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$13.138

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$12.481

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$11.824

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$11.824

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AZTECH Wire

Italy . 784 parts In-Stock

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$14.510

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One Stop Electronics

USA . 697 parts In-Stock

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$26.000

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Corphita

USA . 4,392 parts In-Stock

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UNI Independent Distributors

Spain . 340 parts In-Stock

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Overview

Enhance your electronic projects with the M38510/30901B2X by Texas Instruments, a high-quality Multiplexer & Demultiplexer that offers reliability and precision. Designed with CERAMIC, METAL-SEALED COFIRED materials, this chip carrier is ideal for military-grade applications. With 8 inputs and a fast propagation delay of 56ns, this versatile component operates efficiently in temperatures ranging from -55°C to 125°C. Trust Texas Instruments to deliver top-notch products that exceed expectations. Choose the M38510/30901B2X for superior performance and unmatched value in your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Allows for easy and convenient assembly onto circuit boards, saving time and effort during production.

Screening Level: MIL-M-38510 Class B

Meets stringent military standards, ensuring high quality and reliability in mission-critical applications.

No. of Inputs: 8

Provides ample input channels for versatile signal processing and data manipulation.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, compatible with most electronic systems.

Propagation Delay (tpd): 56 ns

Offers fast signal processing speeds, minimizing latency and improving overall system performance.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, increasing its suitability for industrial and military applications.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold conditions, expanding its operational range.

Technology: TTL

Utilizes TTL technology for reliable and efficient signal processing, ensuring accurate data transmission.

Technical Specifications

Multiplexer & Demultiplexer M38510/30901B2X attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

56 ns

Qualification:

Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

M38510/30901B2X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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