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M38510/01403BEX

Texas Instruments

M38510/01403BEX by Texas Instruments

M38510/01403BEX by Texas Instruments is a MILITARY-grade Multiplexer & Demultiplexer with 4 inputs, 2 functions, and a propagation delay of 29ns. Operating b/w -55 to 125 °C, it has a supply voltage range of 4.5V to 5.5V. Ideal for applications requiring high-speed signal switching in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,328 parts In-Stock

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Digiode

USA . 4,730 parts In-Stock

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Anansix

USA . 2,085 parts In-Stock

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AZTECH Wire

Italy . 818 parts In-Stock

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$19.103

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Parana Technologies

USA . 1,703 parts In-Stock

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$20.547

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$20.627

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DigiPath Technology Company

USA . 2,347 parts In-Stock

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$22.624

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$22.624

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ChromeModa Solutions

Germany . 3,767 parts In-Stock

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$23.086

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$18.931

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$18.931

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IDEA Electronic Components Group

UK . 994 parts In-Stock

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$23.086

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$21.932

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$20.777

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994

$23.086

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One Stop Electronics

USA . 322 parts In-Stock

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$60.000

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Corphita

USA . 5,186 parts In-Stock

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Overview

Elevate your electronic designs with the M38510/01403BEX by Texas Instruments. Crafted with precision and expertise, this multiplexer/demultiplexer offers unparalleled quality and reliability. Perfect for military-grade applications, this product ensures optimal performance in extreme conditions. With its dual functionality and true output polarity, this component guarantees seamless integration and efficient operation. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package body material provides excellent thermal and mechanical protection, ensuring durability and reliability in harsh environments.

No. of Functions: 2

Having 2 functions in one device allows for more versatile and efficient circuit designs, saving space and reducing the need for additional components.

Screening Level: MIL-M-38510 Class B

Meeting MIL-M-38510 Class B screening level standards ensures high quality and reliability, making it suitable for use in critical military or aerospace applications.

No. of Inputs: 4

With 4 inputs, this multiplexer/demultiplexer can handle multiple input signals, providing flexibility in signal routing and data selection.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with standard TTL logic levels and power sources, making integration into existing systems easier.

No. of Terminals: 16

Having 16 terminals allows for easy connections and interfacing with other components, simplifying the overall circuit design.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to mount and secure the device on a circuit board, ensuring a stable and secure connection.

Propagation Delay (tpd): 29 ns

With a low propagation delay of 29 ns, this multiplexer/demultiplexer can quickly switch between inputs, reducing latency and improving overall system performance.

Maximum Operating Temperature: 125 °C

Being able to operate at temperatures up to 125°C allows for use in high temperature environments, expanding the range of applications for this device.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this device can also withstand extremely low temperatures, making it suitable for a wide range of operating conditions.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting and orientation, allowing for easy integration into different types of circuit layouts.

Output Polarity: TRUE

Having true output polarity ensures accurate signal processing and transmission, reducing errors and improving the overall performance of the device.

Minimum Supply Voltage (Vsup): 4.5 V

Operating at a minimum supply voltage of 4.5V provides a reliable power source for the device, ensuring stable and consistent operation.

Temperature Grade: MILITARY

Being rated for military temperature grades indicates that this device meets rigorous standards for performance and reliability, making it suitable for demanding military and aerospace applications.

Technology: TTL

Using TTL technology ensures compatibility with other TTL logic devices, simplifying system integration and reducing compatibility issues.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy and secure soldering onto circuit boards, providing a reliable connection and mechanical stability.

Maximum Supply Voltage (Vsup): 5.5 V

Having a maximum supply voltage of 5.5V provides a safe operating range and protection against overvoltage conditions, ensuring the longevity and reliability of the device.

Technical Specifications

Multiplexer & Demultiplexer M38510/01403BEX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

29 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

M38510/01403BEX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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