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SN74F253DRE4

Texas Instruments

SN74F253DRE4 by Texas Instruments

SN74F253DRE4 by Texas Instruments is a TTL technology multiplexer/demultiplexer with 2 functions and 4 inputs. It has a propagation delay of 13ns at 5V, operates b/w 0-70°C, and features a small outline package for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,555 parts In-Stock

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Digiode

USA . 1,792 parts In-Stock

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1,792

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Distributors (Availability)

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AZTECH Wire

Italy . 703 parts In-Stock

1+ parts

$17.735

100+ parts

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703

$17.735

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Parana Technologies

USA . 539 parts In-Stock

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$19.476

100+ parts

-

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$19.484

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539

$19.476

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$19.484

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ChromeModa Solutions

Germany . 4,217 parts In-Stock

1+ parts

$21.883

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$17.944

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4,217

$21.883

$17.944

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IDEA Electronic Components Group

UK . 1,481 parts In-Stock

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$21.883

100+ parts

$20.789

1k+ parts

$19.695

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1,481

$21.883

$20.789

$19.695

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One Stop Electronics

USA . 825 parts In-Stock

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$26.000

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825

$26.000

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Corphita

USA . 3,247 parts In-Stock

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3,247

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DigiPath Technology Company

USA . 1,377 parts In-Stock

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$19.730

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$19.730

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Overview

Elevate your electronic designs with the SN74F253DRE4 by Texas Instruments, a high-quality multiplexer & demultiplexer that delivers exceptional performance and reliability. As a trusted manufacturer, Texas Instruments ensures that this product meets the highest industry standards, making it ideal for a wide range of applications. Benefit from its fast propagation delay, low power consumption, and compact package size, providing value and efficiency to your projects. Upgrade your circuits with the SN74F253DRE4 and experience superior functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Propagation Delay at Nominal Supply: 13 ns

Low propagation delay ensures fast data transmission which is crucial for efficient multiplexing and demultiplexing operations.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in one device increases efficiency and reduces the need for additional components.

No. of Inputs: 4

Multiple input channels provide flexibility and allow for simultaneous processing of data streams.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V ensures compatibility with standard electronic systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stable performance and minimal signal distortion.

Power Supplies (V): 5

Consistent power supply voltage ensures reliable operation and prevents voltage fluctuations.

No. of Terminals: 16

Sufficient number of terminals for easy connectivity and integration into larger circuit systems.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enhancing flexibility in signal routing and control.

Technical Specifications

Multiplexer & Demultiplexer SN74F253DRE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

23 mA

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74F253DRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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