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MC74HC251ADG

Onsemi

MC74HC251ADG by Onsemi

MC74HC251ADG by Onsemi is an 8-input multiplexer with a propagation delay of 56ns at 5V. It operates in a temperature range of -55 to 125°C, making it suitable for military-grade applications. With a small outline package style and surface mount capability, it offers versatile integration options.

Median Price

$0.309

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 31 parts In-Stock

1+ parts

$0.309

100+ parts

$0.226

1k+ parts

$0.118

10k+ parts

$0.094

31

$0.309

$0.226

$0.118

$0.094

Mouser Electronics

USA . 295 parts In-Stock

1+ parts

$0.460

100+ parts

$0.265

1k+ parts

$0.232

10k+ parts

$0.199

295

$0.460

$0.265

$0.232

$0.199

DigiKey

USA . 695 parts In-Stock

1+ parts

$0.670

100+ parts

$0.275

1k+ parts

$0.179

10k+ parts

$0.131

695

$0.670

$0.275

$0.179

$0.131

Flip Electronics (Authorized)

USA . 23,664 parts In-Stock

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23,664

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Rochester

USA . 23,222 parts In-Stock

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-

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$0.260

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$0.216

10k+ parts

$0.193

23,222

-

$0.260

$0.216

$0.193

Chip1Stop

Japan . 31 parts In-Stock

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-

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$0.203

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31

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$0.203

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Distributors (In-Stock)

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Digiode

USA . 254 parts In-Stock

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$0.202

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254

$0.202

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TME

Poland . 268 parts In-Stock

1+ parts

$0.800

100+ parts

$0.323

1k+ parts

$0.301

10k+ parts

-

268

$0.800

$0.323

$0.301

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Flip Electronics

USA . 23,664 parts In-Stock

1+ parts

-

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23,664

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Vyrian

USA . 7,940 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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Semicontronic

India . 7,691 parts In-Stock

1+ parts

$0.173

100+ parts

$0.169

1k+ parts

$0.168

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-

7,691

$0.173

$0.169

$0.168

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Ampacity Inc.

Singapore . 6,747 parts In-Stock

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$0.173

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6,747

$0.173

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Corphita

USA . 1,485 parts In-Stock

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$0.192

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1,485

$0.192

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Corohmni

South Africa . 308 parts In-Stock

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$0.203

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308

$0.203

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Aztec Data Supply Inc.

USA . 318 parts In-Stock

1+ parts

$31.630

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318

$31.630

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TANS Electronics

Latvia . 6,922 parts In-Stock

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SupplyDigital Components

Austria . 6,850 parts In-Stock

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Problanco Electronics

Mexico . 4,879 parts In-Stock

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Kulean Microsystems

USA . 4,109 parts In-Stock

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Eastek

USA . 3,984 parts In-Stock

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Continental Prestige Electronics

USA . 3,098 parts In-Stock

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Argo Parts USA

USA . 1,521 parts In-Stock

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UHIMA Technologies

Türkiye . 872 parts In-Stock

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872

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the MC74HC251ADG from Onsemi, a leading manufacturer in the industry. This multiplexer & demultiplexer offers seamless integration and versatility for a wide range of applications. With a small outline package style and high-quality plastic/epoxy body material, this product ensures optimal functionality and efficiency. Trust in the superior quality and advanced technology of Onsemi to elevate your projects to the next level. Choose the MC74HC251ADG for unmatched value and benefits that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the device.

Propagation Delay At Nominal Supply: 56 ns

Low propagation delay ensures fast and efficient signal processing.

No. of Inputs: 8

Allows for multiple input signals to be processed simultaneously.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage that is commonly available for powering the device.

Output Characteristics: 3-STATE

Provides flexibility in controlling the output states of the device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Multiplexer & Demultiplexer MC74HC251ADG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

56 ns

Propagation Delay (tpd):

280 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74HC251ADG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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