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MC741VHC157DR2

Onsemi

MC741VHC157DR2 by Onsemi

MC741VHC157DR2 by Onsemi is a 4-function multiplexer with 2 inputs, operating at 3.3V. It has a propagation delay of 15ns and can function in temperatures ranging from -40 to 85 °C. Ideal for industrial applications requiring fast signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,571 parts In-Stock

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Digiode

USA . 752 parts In-Stock

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752

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Kulean Microsystems

USA . 7,994 parts In-Stock

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7,994

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SupplyDigital Components

Austria . 6,823 parts In-Stock

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TANS Electronics

Latvia . 5,379 parts In-Stock

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Problanco Electronics

Mexico . 3,565 parts In-Stock

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3,565

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Corphita

USA . 2,409 parts In-Stock

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2,409

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UHIMA Technologies

Türkiye . 363 parts In-Stock

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Corohmni

South Africa . 107 parts In-Stock

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Overview

Experience seamless data transmission with the MC741VHC157DR2 by Onsemi, a top-tier manufacturer known for quality and reliability. This multiplexer/demultiplexer is perfect for various applications, offering customers exceptional value and benefits. With its advanced technology and industrial-grade temperature rating, this product ensures optimal performance even in the most demanding conditions. Trust Onsemi to deliver cutting-edge solutions for all your data processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protection for the internal components of the multiplexer/demultiplexer, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying the assembly process.

No. of Functions: 4

Having 4 functions in one device increases efficiency and reduces the need for additional components, saving cost and board space.

No. of Inputs: 2

Having 2 inputs provides flexibility for data input sources, allowing for versatile usage in different applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with a wide range of electronic systems, making it easy to integrate.

No. of Terminals: 16

Having 16 terminals allows for multiple connections, enabling effective communication and data transfer between components.

Propagation Delay (tpd): 15 ns

Low propagation delay of 15ns ensures fast and efficient data transmission, making the product suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the multiplexer/demultiplexer can function reliably in harsh environmental conditions, enhancing its durability.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes the product suitable for use in various environments, including extreme cold conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides a reliable connection and helps prevent oxidation, ensuring long-term performance and reliability.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, the multiplexer/demultiplexer can handle higher voltage levels, providing flexibility for different power requirements.

Technical Specifications

Multiplexer & Demultiplexer MC741VHC157DR2 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

MC741VHC157DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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