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MC74AC151DT

Onsemi

MC74AC151DT by Onsemi

MC74AC151DT by Onsemi is an 8-input multiplexer with a propagation delay of 16ns at 5V. It operates in industrial temperature range (-40 to 85 °C) and supports power supplies of 3.3/5V. With a small outline package style, it is suitable for applications requiring fast switching b/w multiple inputs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,338 parts In-Stock

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Digiode

USA . 686 parts In-Stock

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TANS Electronics

Latvia . 7,637 parts In-Stock

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Kulean Microsystems

USA . 6,807 parts In-Stock

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SupplyDigital Components

Austria . 4,833 parts In-Stock

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Problanco Electronics

Mexico . 4,652 parts In-Stock

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UHIMA Technologies

Türkiye . 608 parts In-Stock

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Corohmni

South Africa . 361 parts In-Stock

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Corphita

USA . 179 parts In-Stock

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Overview

Discover the versatile MC74AC151DT by Onsemi, a high-quality multiplexer & demultiplexer that offers unparalleled performance and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, you can trust that this product is designed to meet your needs with precision. Ideal for a wide range of applications, this device provides seamless integration and efficient operation. Experience the value and benefits of this innovative solution, bringing convenience and efficiency to your projects. Choose the MC74AC151DT for superior quality and performance that surpasses expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to various environmental factors, making the product suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 16 ns

Low propagation delay ensures fast data processing and minimal signal distortion, making this multiplexer/demultiplexer efficient and reliable.

No. of Inputs: 8

Having 8 inputs allows for versatile connectivity options, making this product suitable for applications that require multiple input sources.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with standard power sources, ensuring ease of integration into various systems.

Maximum I (ol): 12 Amp

The high maximum output current rating of 12A allows for robust performance and reliable operation, especially in applications that require high current output.

Technology: CMOS

The CMOS technology used in this multiplexer/demultiplexer offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85 °C ensures reliable operation even in harsh environmental conditions, making this product suitable for industrial applications.

Technical Specifications

Multiplexer & Demultiplexer MC74AC151DT attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

12 Amp

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74AC151DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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