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MC74AC153DR2G

Onsemi

MC74AC153DR2G by Onsemi

MC74AC153DR2G by Onsemi is a 16-terminal CMOS multiplexer/demultiplexer with 2 functions and 4 inputs. It operates at a supply voltage range of 2V to 6V, with a propagation delay of 14.5ns. Ideal for industrial applications requiring true output polarity in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,486 parts In-Stock

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Digiode

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Kulean Microsystems

USA . 5,176 parts In-Stock

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Problanco Electronics

Mexico . 4,947 parts In-Stock

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TANS Electronics

Latvia . 4,614 parts In-Stock

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SupplyDigital Components

Austria . 2,613 parts In-Stock

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Corphita

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Corohmni

South Africa . 483 parts In-Stock

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UHIMA Technologies

Türkiye . 420 parts In-Stock

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Kepictronics

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Overview

Unlock the power of seamless data management with the MC74AC153DR2G by Onsemi. As a trusted leader in semiconductor technology, Onsemi delivers top-quality products that exceed expectations. The MC74AC153DR2G is a versatile multiplexer & demultiplexer that offers unparalleled performance and reliability. Ideal for a wide range of applications, this product provides customers with a cost-effective solution that simplifies complex processes. Experience the value and benefits of Onsemi's MC74AC153DR2G and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer & demultiplexer.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying the manufacturing process.

No. of Functions: 2

Provides functionality for both multiplexing and demultiplexing signals, offering versatility in signal processing.

No. of Inputs: 4

Can handle multiple input signals simultaneously, increasing the efficiency of signal transmission and processing.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with most systems and power sources.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the PCB and allows for easy integration into electronic devices.

Propagation Delay (tpd): 14.5 ns

Fast signal processing speed ensures minimal delay in transmitting signals, improving overall system performance.

Maximum Operating Temperature: 85 °C

Can function effectively in high-temperature environments, making it suitable for various industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in cold temperatures without compromising performance, providing reliability in diverse operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer MC74AC153DR2G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

14.5 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

MC74AC153DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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