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SN74AS153FN3

Texas Instruments

SN74AS153FN3 by Texas Instruments

SN74AS153FN3 by Texas Instruments is a TTL technology multiplexer/demultiplexer with 2 functions and 4 inputs. It comes in a square chip carrier package style, suitable for commercial applications with an operating temperature range of 0-70°C. Ideal for electronic systems requiring signal routing and selection capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,875

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Digiode

USA . 2,693 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,693

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 580 parts In-Stock

1+ parts

$6.184

100+ parts

-

1k+ parts

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10k+ parts

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580

$6.184

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Parana Technologies

USA . 1,857 parts In-Stock

1+ parts

$9.171

100+ parts

-

1k+ parts

$9.819

10k+ parts

-

1,857

$9.171

-

$9.819

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ChromeModa Solutions

Germany . 6,187 parts In-Stock

1+ parts

$10.305

100+ parts

$8.450

1k+ parts

-

10k+ parts

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6,187

$10.305

$8.450

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IDEA Electronic Components Group

UK . 1,816 parts In-Stock

1+ parts

$10.305

100+ parts

$9.790

1k+ parts

$9.274

10k+ parts

-

1,816

$10.305

$9.790

$9.274

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One Stop Electronics

USA . 757 parts In-Stock

1+ parts

$50.000

100+ parts

-

1k+ parts

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10k+ parts

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757

$50.000

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Corphita

USA . 2,152 parts In-Stock

1+ parts

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2,152

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DigiPath Technology Company

USA . 948 parts In-Stock

1+ parts

-

100+ parts

$9.291

1k+ parts

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10k+ parts

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948

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$9.291

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Overview

Upgrade your electronic projects with the SN74AS153FN3 by Texas Instruments, a top-quality multiplexer & demultiplexer chip carrier that offers unmatched performance and reliability. With 2 functions and 4 inputs, this versatile component is perfect for a wide range of applications. Texas Instruments is known for its cutting-edge technology and commitment to excellence, ensuring that you get the best value for your money. Trust in the SN74AS153FN3 to deliver superior results and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and resistant to heat and moisture, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on PCBs, saving space and reducing assembly time.

No. of Functions: 2

Having 2 functions in one component allows for more efficient circuit design and saves space on the board.

No. of Inputs: 4

With 4 inputs, this multiplexer & demultiplexer can handle multiple data streams simultaneously, increasing versatility.

Package Shape: SQUARE

Square package shape is compact and efficient, fitting well on PCBs and utilizing space effectively.

No. of Terminals: 20

Having 20 terminals allows for multiple connections, enabling complex circuit configurations and functionality.

Package Style: CHIP CARRIER

Chip carrier package style is convenient for handling and installing, providing protection to the components.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this multiplexer & demultiplexer can function reliably under normal operating conditions.

Minimum Operating Temperature: 0 °C

Operating at temperatures as low as 0°C ensures that this product can perform in a variety of environmental conditions.

Terminal Position: QUAD

Quad terminal position allows for easy connectivity and installation, reducing the chances of errors during assembly.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that this product is suitable for standard commercial applications.

Technology: TTL

TTL technology offers high-speed data transmission and reliable performance in digital circuits.

Terminal Form: J BEND

J bend terminal form provides secure connections and ease of soldering during assembly.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this multiplexer & demultiplexer is compatible with standard PCB designs and assembly processes.

Technical Specifications

Multiplexer & Demultiplexer SN74AS153FN3 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74AS153FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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