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SN74LS357JP4

Texas Instruments

SN74LS357JP4 by Texas Instruments

SN74LS357JP4 by Texas Instruments is an 8-input TTL multiplexer with open-collector output. Operating temperature range of 0-70°C, it has a ceramic package with 20 terminals in an in-line rectangular shape. Ideal for commercial applications requiring high-speed data switching and signal routing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,844 parts In-Stock

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4,844

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Vyrian

USA . 4,221 parts In-Stock

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4,221

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 896 parts In-Stock

1+ parts

$12.288

100+ parts

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896

$12.288

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One Stop Electronics

USA . 382 parts In-Stock

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$17.000

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382

$17.000

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Parana Technologies

USA . 1,809 parts In-Stock

1+ parts

$17.039

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$17.264

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1,809

$17.039

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$17.264

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ChromeModa Solutions

Germany . 2,431 parts In-Stock

1+ parts

$19.145

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$15.699

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2,431

$19.145

$15.699

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IDEA Electronic Components Group

UK . 1,272 parts In-Stock

1+ parts

$19.145

100+ parts

$18.188

1k+ parts

$17.230

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1,272

$19.145

$18.188

$17.230

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Corphita

USA . 2,965 parts In-Stock

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2,965

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DigiPath Technology Company

USA . 289 parts In-Stock

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$17.261

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289

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$17.261

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Overview

Discover the cutting-edge SN74LS357JP4 by Texas Instruments, a top-tier manufacturer known for their superior quality and innovation in the field of Multiplexer & Demultiplexer technology. This versatile product offers customers unrivaled performance and reliability, making it ideal for a wide range of applications. With its sleek design and advanced features, this product brings exceptional value and benefits to any project, ensuring seamless operation and optimal results. Choose Texas Instruments for unmatched quality and excellence in electronic components.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity, ensuring efficient heat dissipation and overall product reliability.

No. of Inputs: 8

Having 8 inputs allows for increased versatility and the ability to handle multiple input signals simultaneously.

Package Shape: RECTANGULAR

Rectangular shape makes the package easy to handle and integrate into existing systems.

No. of Terminals: 20

With 20 terminals, the product can accommodate multiple connections, making it suitable for complex systems.

Package Style (Meter): IN-LINE

In-line package style allows for easy PCB mounting and compact integration into circuit designs.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures the product can withstand a range of environmental conditions.

Output Characteristics: OPEN-COLLECTOR

Open-collector output provides flexibility in interfacing with other components and systems.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can operate even in colder environments.

Terminal Position: DUAL

Dual terminal position allows for easy connectivity and ensures stability during operation.

Temperature Grade: COMMERCIAL

Commercial temperature grade is suitable for standard operating conditions in commercial applications.

Technology: TTL

TTL technology offers high-speed performance and compatibility with a wide range of systems.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure connections and ease of soldering during assembly.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy PCB layout and compatibility with common electronic components.

Technical Specifications

Multiplexer & Demultiplexer SN74LS357JP4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74LS357JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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