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SN74HC158FH4

Texas Instruments

SN74HC158FH4 by Texas Instruments

SN74HC158FH4 by Texas Instruments is a CMOS multiplexer with 4 functions and 2 inputs. It operates in industrial temperature range (-40 to 85°C) and has a ceramic package body material. Suitable for various applications requiring high-performance signal switching.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,042 parts In-Stock

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3,042

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Digiode

USA . 2,738 parts In-Stock

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2,738

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 466 parts In-Stock

1+ parts

$11.253

100+ parts

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466

$11.253

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Parana Technologies

USA . 1,729 parts In-Stock

1+ parts

$26.470

100+ parts

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$27.052

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1,729

$26.470

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$27.052

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DigiPath Technology Company

USA . 730 parts In-Stock

1+ parts

$29.147

100+ parts

$26.815

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730

$29.147

$26.815

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IDEA Electronic Components Group

UK . 1,557 parts In-Stock

1+ parts

$29.742

100+ parts

$28.255

1k+ parts

$26.768

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1,557

$29.742

$28.255

$26.768

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ChromeModa Solutions

Germany . 491 parts In-Stock

1+ parts

$29.742

100+ parts

$24.388

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491

$29.742

$24.388

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One Stop Electronics

USA . 1,575 parts In-Stock

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$52.000

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1,575

$52.000

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Corphita

USA . 2,295 parts In-Stock

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2,295

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Overview

Unlock the power of seamless data transmission with the SN74HC158FH4 by Texas Instruments. Crafted with precision and quality, this multiplexer/demultiplexer offers unparalleled performance and reliability. Ideal for a wide range of applications, this versatile chip carrier is designed to meet industrial standards, ensuring smooth operation even in challenging environments. Experience the value and benefits of this cutting-edge technology, providing customers with a competitive edge in their projects. Choose Texas Instruments for superior quality and unmatched innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and stability, making it suitable for high temperature environments and ensuring durability for long-term use.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation on PCBs, saving space and improving overall manufacturing process.

No. of Functions: 4

Having 4 functions in one device increases efficiency by reducing the need for multiple components, simplifies circuit design, and saves board space.

No. of Inputs: 2

With 2 inputs, this multiplexer/demultiplexer provides flexibility in routing signals to multiple outputs, allowing for versatile system configurations.

Package Shape: SQUARE

Square package shape ensures efficient use of space on the PCB and contributes to a neat and organized layout of components.

Power Supplies (V): 2/6

Supporting multiple power supply voltages (2V and 6V) adds flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and signal routing options, enabling complex circuit configurations and connectivity with other components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides protection for the internal components, easy handling during assembly, and efficient heat dissipation for reliable operation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this multiplexer/demultiplexer can withstand high temperature environments, ensuring stable performance in various conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40°C to 85°C allows for operation in extreme temperature conditions, making it suitable for industrial applications.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connection with other components or devices, ensuring stable signal transmission and reliable performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, offering durability and long-term performance.

Technology: CMOS

CMOS technology provides low power consumption, high speed operation, and compatibility with a wide range of digital systems, making it an efficient choice for multiplexer/demultiplexer applications.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of solder joint cracking, enhances thermal performance, and improves overall reliability of the product.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this multiplexer/demultiplexer allows for precise and compact mounting on PCBs, contributing to a more efficient and reliable circuit design.

Technical Specifications

Multiplexer & Demultiplexer SN74HC158FH4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74HC158FH4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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