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DM74LS157N

Texas Instruments

DM74LS157N by Texas Instruments

DM74LS157N by Texas Instruments is a TTL multiplexer with 4 functions and 2 inputs. It operates at a supply voltage range of 4.75V to 5.25V, with a propagation delay of 23ns. This rectangular package is commonly used in commercial applications for signal routing and data selection tasks.

Median Price

$0.409

Lifecycle Status

Suppliers In-Stock

57

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 8 parts In-Stock

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$0.409

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$0.385

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$0.348

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Freelance Electronics

USA . 194 parts In-Stock

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Digiode

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Component Electronics Inc.

Canada . 288 parts In-Stock

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TEDSS.com

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Corphita

USA . 3,318 parts In-Stock

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$0.368

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Component Stockers USA

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Native Components

USA . 450 parts In-Stock

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Northwest PG Solutions

USA . 1,578 parts In-Stock

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$8.555

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$7.700

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Parana Technologies

USA . 1,561 parts In-Stock

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$23.521

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DigiPath Technology Company

USA . 2,042 parts In-Stock

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$23.159

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ChromeModa Solutions

Germany . 5,782 parts In-Stock

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$21.063

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IDEA Electronic Components Group

UK . 1,939 parts In-Stock

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Lixinc

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Overview

Unlock the power of efficient data handling with the Texas Instruments DM74LS157N multiplexer/demultiplexer. Manufactured by a trusted industry leader, this versatile component offers seamless integration and reliable performance. Perfect for a wide range of applications, from telecommunications to industrial automation, this product provides unparalleled value, benefits, and advantages. Upgrade your systems with the DM74LS157N and experience enhanced functionality and precision in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to environmental factors, making the product suitable for long-term use in various conditions.

No. of Functions: 4

Having 4 functions allows for versatile multiplexing and demultiplexing capabilities, making the product suitable for complex signal routing needs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and facilitates easy integration into existing systems.

Propagation Delay (tpd): 23 ns

Low propagation delay of 23 ns ensures fast signal processing and minimal signal distortion, making the product ideal for applications requiring real-time data manipulation.

Temperature Grade: COMMERCIAL

Commercial-grade temperature range of 0 to 70°C ensures reliable operation in typical environmental conditions, making the product suitable for a wide range of indoor applications.

Technical Specifications

Multiplexer & Demultiplexer DM74LS157N attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

23 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DM74LS157N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-050-0921, 5962010500921, 5962-01-264-2709, 5962012642709, 5962-99-656-5442, 5962996565442

NIIN

010500921, 012642709, 996565442

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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