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DM74LS151M

Texas Instruments

DM74LS151M by Texas Instruments

The Texas Instruments DM74LS151M is an 8-input multiplexer with a propagation delay of 35 ns. Operating at a supply voltage range of 4.75V to 5.25V, it is ideal for commercial applications requiring fast signal switching in a small outline package. With surface mount capability and TTL technology, this device offers high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 7,636 parts In-Stock

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Digiode

USA . 2,274 parts In-Stock

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MRC Electronics

USA . 1,882 parts In-Stock

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Anansix

USA . 1,807 parts In-Stock

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Resion

USA . 450 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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Holdelec - ElecDif-Pro

France . 50 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 949 parts In-Stock

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$8.119

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$8.119

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Northwest PG Solutions

USA . 261 parts In-Stock

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$8.931

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$8.038

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Parana Technologies

USA . 857 parts In-Stock

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$19.475

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$19.483

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AZTECH Wire

Italy . 423 parts In-Stock

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DigiPath Technology Company

USA . 1,273 parts In-Stock

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$21.444

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$19.729

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Advanced Electronics

New Zealand . 300 parts In-Stock

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ChromeModa Solutions

Germany . 6,991 parts In-Stock

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IDEA Electronic Components Group

UK . 749 parts In-Stock

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$20.788

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$19.694

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One Stop Electronics

USA . 399 parts In-Stock

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Glotronic Ltd.

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Corphita

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Supply Digital

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Infinite Electronics LLP (Excess)

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Overview

Enhance your electronic projects with the DM74LS151M by Texas Instruments, a top-tier manufacturer in the industry. This multiplexer/demultiplexer offers unmatched quality and reliability, making it a standout choice for various applications. With 8 inputs and a fast propagation delay of 35 ns, this product ensures efficient performance. Its compact design and wide operating temperature range make it versatile for any project. Trust in Texas Instruments to deliver exceptional value and benefits with the DM74LS151M, providing you with a competitive edge in the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the multiplexer/demultiplexer.

Surface Mount: YES

With surface mount capability, this product can be easily integrated onto circuit boards, making it suitable for compact designs.

No. of Inputs: 8

Having 8 inputs allows for versatile input options, making it suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources.

Propagation Delay (tpd): 35 ns

The low propagation delay of 35 ns ensures fast signal processing, ideal for time-sensitive applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows for reliable performance in various environmental conditions.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of digital systems and devices.

Technical Specifications

Multiplexer & Demultiplexer DM74LS151M attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G16

Length:

9.902 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

35 ns

Maximum Seated Height:

1.753 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.899 mm

Trade Compliance

DM74LS151M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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