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DM74LS153N/A+

Texas Instruments

DM74LS153N/A+ by Texas Instruments

DM74LS153N/A+ by Texas Instruments is a TTL technology multiplexer/demultiplexer with 2 functions, 4 inputs, and 35 ns propagation delay. It operates at a supply voltage range of 4.75V to 5.25V and temperature range of 0°C to 70°C. Ideal for commercial applications requiring true output polarity control in an inline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,380 parts In-Stock

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Vyrian

USA . 2,093 parts In-Stock

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Digiode

USA . 295 parts In-Stock

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295

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,564 parts In-Stock

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$3.234

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$3.234

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AZTECH Wire

Italy . 397 parts In-Stock

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$7.099

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397

$7.099

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One Stop Electronics

USA . 980 parts In-Stock

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$8.000

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980

$8.000

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Parana Technologies

USA . 327 parts In-Stock

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$23.075

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$23.717

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327

$23.075

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$23.717

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DigiPath Technology Company

USA . 2,283 parts In-Stock

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$25.408

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$25.408

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ChromeModa Solutions

Germany . 3,515 parts In-Stock

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$25.927

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$21.260

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3,515

$25.927

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IDEA Electronic Components Group

UK . 1,068 parts In-Stock

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$25.927

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$24.631

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$23.334

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1,068

$25.927

$24.631

$23.334

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Corphita

USA . 3,676 parts In-Stock

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Native Components

USA . 35 parts In-Stock

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$2.852

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Overview

Enhance your electronic projects with the DM74LS153N/A+ by Texas Instruments, a top-quality multiplexer & demultiplexer that offers unmatched reliability and precision. With 2 functions, 4 inputs, and a nominal supply voltage of 5V, this product is perfect for a wide range of applications. From data transmission to signal routing, this versatile component delivers exceptional performance. Trust in Texas Instruments for cutting-edge technology and unparalleled value. Elevate your designs with the DM74LS153N/A+ today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring reliability and longevity.

No. of Functions: 2

Allows for versatile usage in different applications where multiple functions are required to be performed.

No. of Inputs: 4

Provides flexibility and capability to handle multiple input signals efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage, making it compatible with many power sources.

No. of Terminals: 16

Offers ample connectivity options for various input and output channels, enhancing compatibility.

Propagation Delay (tpd): 35 ns

Ensures efficient and fast signal processing, reducing latency in data transmission.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for use in diverse environments.

Minimum Operating Temperature: 0 °C

Maintains functionality even in low-temperature conditions, ensuring reliability in extreme climates.

Output Polarity: TRUE

Provides accurate and consistent output signals, enhancing performance and signal integrity.

Technology: TTL

Utilizes TTL technology for logic operations, ensuring compatibility with a wide range of digital systems.

Technical Specifications

Multiplexer & Demultiplexer DM74LS153N/A+ attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDIP-T16

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

35 ns

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

DM74LS153N/A+ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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