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CD74AC251MG4

Texas Instruments

CD74AC251MG4 by Texas Instruments

CD74AC251MG4 by Texas Instruments is an 8-input multiplexer with a propagation delay of 20.9 ns at 3.3V, suitable for military-grade applications. It features a small outline package style, operates within a temperature range of -55 to 125°C, and has a max supply voltage of 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,470 parts In-Stock

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Digiode

USA . 3,503 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Parana Technologies

USA . 66 parts In-Stock

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$18.173

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$18.314

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66

$18.173

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$18.314

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AZTECH Wire

Italy . 551 parts In-Stock

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$18.695

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551

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DigiPath Technology Company

USA . 1,655 parts In-Stock

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$20.011

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$20.011

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IDEA Electronic Components Group

UK . 1,228 parts In-Stock

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$20.419

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$19.398

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$18.377

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$18.377

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ChromeModa Solutions

Germany . 864 parts In-Stock

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$20.419

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$16.744

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One Stop Electronics

USA . 1,303 parts In-Stock

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$22.000

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Ampacity Inc.

Singapore . 659 parts In-Stock

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$60.000

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Corphita

USA . 4,535 parts In-Stock

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Microchip USA

USA . 4,054 parts In-Stock

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Argo Parts USA

USA . 3,537 parts In-Stock

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Continental Prestige Electronics

USA . 3,519 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Enhance your electronic projects with the CD74AC251MG4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This multiplexer & demultiplexer offers unparalleled reliability and performance, making it the ideal choice for a wide range of applications. With 8 inputs and 3-STATE output characteristics, this product provides seamless functionality and versatility. Trust in Texas Instruments to bring you cutting-edge technology that exceeds expectations. Elevate your designs with the CD74AC251MG4 and experience the difference in quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 20.9 ns

Fast propagation delay ensures efficient data transmission and processing, making this product suitable for high-speed applications.

No. of Inputs: 8

Having 8 inputs allows for versatile connectivity options, enabling the multiplexer/demultiplexer to handle multiple input signals effectively.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, this product offers energy efficiency and compatibility with standard voltage levels.

Output Characteristics: 3-STATE

3-STATE output characteristics allow for flexibility in controlling the output signal, making it suitable for bidirectional communication and bus systems.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall performance and reliability of the multiplexer/demultiplexer.

Technical Specifications

Multiplexer & Demultiplexer CD74AC251MG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

20.9 ns

Propagation Delay (tpd):

186 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74AC251MG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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