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CD54HC153W

Texas Instruments

CD54HC153W by Texas Instruments

CD54HC153W by Texas Instruments is a CMOS multiplexer/demultiplexer with 2 functions, 4 inputs, and 16 terminals. It has a propagation delay of 240 ns and operates in temperatures ranging from -55 to 125°C. Ideal for military applications due to its MIL-graded technology and true output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,221 parts In-Stock

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Vyrian

USA . 2,676 parts In-Stock

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2,676

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Distributors (Availability)

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Native Components

USA . 5 parts In-Stock

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$0.196

100+ parts

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$0.188

5

$0.196

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$0.188

Northwest PG Solutions

USA . 726 parts In-Stock

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$0.216

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$0.190

726

$0.216

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$0.190

Parana Technologies

USA . 676 parts In-Stock

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$7.129

100+ parts

$662.026

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$6.416

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676

$7.129

$662.026

$6.416

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AZTECH Wire

Italy . 497 parts In-Stock

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$7.749

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497

$7.749

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DigiPath Technology Company

USA . 1,497 parts In-Stock

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$7.850

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1,497

$7.850

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ChromeModa Solutions

Germany . 885 parts In-Stock

1+ parts

$8.010

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$6.568

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885

$8.010

$6.568

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IDEA Electronic Components Group

UK . 116 parts In-Stock

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$8.010

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$7.209

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116

$8.010

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One Stop Electronics

USA . 1,229 parts In-Stock

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$30.000

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1,229

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Corphita

USA . 3,769 parts In-Stock

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Overview

Unlock the power of versatile signal processing with the CD54HC153W by Texas Instruments. This high-quality multiplexer & demultiplexer boasts a compact surface-mount design, making it ideal for a wide range of applications. With 2 functions, 4 inputs, and fast propagation delay, this military-grade technology offers superior performance in extreme temperatures. Trust Texas Instruments for reliable solutions that deliver value and efficiency to your projects. Elevate your designs with the CD54HC153W today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and increasing reliability.

No. of Functions: 2

Having multiple functions in a single device can simplify circuit design and reduce component count, leading to cost and space savings.

No. of Inputs: 4

Having multiple inputs allows for versatile signal routing and connectivity options.

No. of Terminals: 16

Having a high number of terminals enables complex signal routing and connections in the circuit.

Package Style (Meter): UNCASED CHIP

The unencased chip package style offers flexibility in integration and customization within specific applications or designs.

Propagation Delay (tpd): 240 ns

The low propagation delay ensures fast signal processing and minimal signal distortion in the circuit.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding temperature environments and operate reliably.

Minimum Operating Temperature: -55 °C

The wide range of operating temperature allows for usage in extreme temperature conditions without compromising performance.

Output Polarity: TRUE

Having true output polarity ensures consistent signal output behavior, simplifying design and integration.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement enables operation in low-power applications and extends battery life.

Temperature Grade: MILITARY

The military temperature grade ensures high reliability and performance in rugged and harsh operating environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this product efficient and reliable.

Terminal Form: NO LEAD

The no lead terminal form simplifies PCB mounting and soldering processes, enhancing manufacturing efficiency.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage tolerance makes the product versatile for use in different voltage supply scenarios without risking damage.

Technical Specifications

Multiplexer & Demultiplexer CD54HC153W attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

X-XUUC-N16

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

CD54HC153W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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