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CD54AC157F3A

Texas Instruments

CD54AC157F3A by Texas Instruments

CD54AC157F3A by Texas Instruments is a CMOS multiplexer with 4 functions, 2 inputs, and 2 bits. It operates at a nominal voltage of 3.3V with a propagation delay of 9ns. Ideal for military-grade applications requiring fast signal switching in compact designs.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 5,043 parts In-Stock

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Digiode

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Manoshevitz Elec. Sales

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Resion

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Prism Electronics

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Mil-Aero Solutions, Inc.

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Native Components

USA . 990 parts In-Stock

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$0.726

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Northwest PG Solutions

USA . 2,310 parts In-Stock

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$0.798

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AZTECH Wire

Italy . 378 parts In-Stock

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Parana Technologies

USA . 1,561 parts In-Stock

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$18.959

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$1,760.610

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$17.063

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DigiPath Technology Company

USA . 1,465 parts In-Stock

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$20.876

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ChromeModa Solutions

Germany . 5,713 parts In-Stock

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IDEA Electronic Components Group

UK . 1,197 parts In-Stock

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One Stop Electronics

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Authorized Procurement Solutions

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Glotronic Ltd.

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Corphita

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Microchip USA

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Assy Fe

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Kepictronics

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Overview

Enhance your electronic projects with the CD54AC157F3A from Texas Instruments, a high-quality multiplexer & demultiplexer that offers unparalleled performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product is built to last. Perfect for a variety of applications, this versatile component provides 4 functions, 2 inputs, and a nominal supply voltage of 3.3V, making it ideal for a wide range of projects. Experience the value and benefits of this top-tier product and take your designs to the next level with the CD54AC157F3A.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides a durable and reliable housing for the multiplexer/demultiplexer, ensuring long-term performance and protection against environmental factors.

No. of Functions: 4

Can handle multiple functions simultaneously, making it versatile and efficient for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, making it compatible with most systems and power supplies.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in demanding environments or industrial applications.

Technology: CMOS

Utilizes CMOS technology, known for low power consumption and high noise immunity, resulting in efficient operation and reliable performance.

Technical Specifications

Multiplexer & Demultiplexer CD54AC157F3A attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

106 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

6.92 mm

Trade Compliance

CD54AC157F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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