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CD54HC157F3A96

Texas Instruments

CD54HC157F3A96 by Texas Instruments

CD54HC157F3A96 by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at supply voltages from 2V to 6V. With a propagation delay of 190ns and temperature range of -55°C to 125°C, it's ideal for military-grade applications requiring high-speed signal switching in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,783 parts In-Stock

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Digiode

USA . 4,902 parts In-Stock

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Native Components

USA . 129 parts In-Stock

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$1.130

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$1.130

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Northwest PG Solutions

USA . 826 parts In-Stock

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$1.243

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826

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AZTECH Wire

Italy . 594 parts In-Stock

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$8.625

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Parana Technologies

USA . 167 parts In-Stock

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$10.395

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$965.352

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$9.356

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167

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$9.356

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DigiPath Technology Company

USA . 1,080 parts In-Stock

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$11.446

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ChromeModa Solutions

Germany . 5,166 parts In-Stock

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$11.680

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$9.578

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IDEA Electronic Components Group

UK . 2,132 parts In-Stock

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$11.680

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$11.096

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$10.512

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One Stop Electronics

USA . 1,026 parts In-Stock

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$47.000

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Corphita

USA . 4,494 parts In-Stock

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Overview

Enhance your electronic projects with the CD54HC157F3A96 by Texas Instruments, a high-quality multiplexer & demultiplexer designed to streamline your circuit designs. With a reputation for excellence, Texas Instruments delivers reliable components that meet rigorous standards. This versatile device offers 4 functions and 2 inputs in a durable ceramic, glass-sealed package, making it ideal for military-grade applications. Trust in Texas Instruments for top-notch performance and efficiency in your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the internal components, making the product reliable for long-term use.

No. of Functions: 4

With 4 functions in one device, this multiplexer & demultiplexer offers versatility and efficiency in managing multiple inputs and outputs.

Nominal Supply Voltage / Vsup (V): 4.5

The specified supply voltage of 4.5V ensures stable and consistent performance of the product within the recommended voltage range.

Propagation Delay (tpd): 190 ns

The low propagation delay of 190 nanoseconds indicates fast signal processing capabilities, allowing for quick switching and data transfer.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures that the product can function reliably even in extreme temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the multiplexer & demultiplexer efficient and reliable in various applications.

Technical Specifications

Multiplexer & Demultiplexer CD54HC157F3A96 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-GDIP-T16

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

CD54HC157F3A96 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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