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CD54ACT253F3A

Texas Instruments

CD54ACT253F3A by Texas Instruments

CD54ACT253F3A by Texas Instruments is a CMOS Multiplexer & Demultiplexer with 2 functions, 4 inputs, and 18ns propagation delay at 5V. Ideal for military applications due to its MIL-Grade temperature range of -55°C to 125°C and glass-sealed ceramic package.

Median Price

$21.220

Lifecycle Status

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Freelance Electronics

USA . 19 parts In-Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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One Stop Electronics

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AZTECH Wire

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 5,282 parts In-Stock

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IDEA Electronic Components Group

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Northwest PG Solutions

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Overview

Experience the power of cutting-edge technology with the CD54ACT253F3A multiplexer & demultiplexer by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-notch products that meet the highest industry standards. This versatile component is perfect for a wide range of applications, offering seamless functionality and exceptional performance. Say goodbye to compromises and discover the value of precision engineering with the CD54ACT253F3A.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides high durability and reliability, making the product suitable for harsh environments.

Propagation Delay At Nominal Supply: 18 ns

Low propagation delay ensures fast signal processing, making the product efficient and responsive.

No. of Functions: 2

Having multiple functions in one device saves space and simplifies circuit design.

No. of Inputs: 4

Having multiple inputs allows for versatility and flexibility in connecting various sources.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage, making it compatible with most systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for demanding industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer CD54ACT253F3A attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD54ACT253F3A Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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