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NC7SZ157L6X-L22175

Onsemi

NC7SZ157L6X-L22175 by Onsemi

The Onsemi NC7SZ157L6X-L22175 is a CMOS multiplexer with 2 inputs, 10.5 ns propagation delay, and 1.8V nominal voltage. Ideal for industrial applications requiring fast signal switching in compact designs due to its small outline package and low power consumption.

Median Price

$0.330

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,365 parts In-Stock

1+ parts

$0.410

100+ parts

$0.203

1k+ parts

$0.116

10k+ parts

$0.093

1,365

$0.410

$0.203

$0.116

$0.093

Flip Electronics (Authorized)

USA . 130,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

130,000

-

-

-

-

DigiKey

USA . 120,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.250

120,000

-

-

-

$0.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$0.133

100+ parts

-

1k+ parts

-

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-

52

$0.133

-

-

-

Digiode

USA . 236 parts In-Stock

1+ parts

$0.390

100+ parts

-

1k+ parts

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236

$0.390

-

-

-

Flip Electronics

USA . 120,000 parts In-Stock

1+ parts

-

100+ parts

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120,000

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-

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Vyrian

USA . 67,559 parts In-Stock

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67,559

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-

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Distributors (Availability)

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Ampacity Inc.

Singapore . 67,724 parts In-Stock

1+ parts

$0.060

100+ parts

-

1k+ parts

-

10k+ parts

-

67,724

$0.060

-

-

-

Corohmni

South Africa . 63 parts In-Stock

1+ parts

$0.070

100+ parts

-

1k+ parts

-

10k+ parts

-

63

$0.070

-

-

-

Continental Prestige Electronics

USA . 6,394 parts In-Stock

1+ parts

$0.132

100+ parts

-

1k+ parts

-

10k+ parts

$0.129

6,394

$0.132

-

-

$0.129

Argo Parts USA

USA . 359 parts In-Stock

1+ parts

$0.132

100+ parts

-

1k+ parts

-

10k+ parts

$0.128

359

$0.132

-

-

$0.128

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.133

100+ parts

-

1k+ parts

$0.126

10k+ parts

$0.124

100

$0.133

-

$0.126

$0.124

Corphita

USA . 1,141 parts In-Stock

1+ parts

$0.369

100+ parts

-

1k+ parts

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10k+ parts

-

1,141

$0.369

-

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Microchip USA

USA . 7,991 parts In-Stock

1+ parts

$0.740

100+ parts

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1k+ parts

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7,991

$0.740

-

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Aztec Data Supply Inc.

USA . 3,224 parts In-Stock

1+ parts

$19.929

100+ parts

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3,224

$19.929

-

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QUARKTWIN TECHNOLOGY LTD

USA . 12,997 parts In-Stock

1+ parts

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12,997

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Eastek

USA . 10,000 parts In-Stock

1+ parts

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10,000

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SupplyDigital Components

Austria . 7,987 parts In-Stock

1+ parts

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7,987

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TANS Electronics

Latvia . 7,856 parts In-Stock

1+ parts

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7,856

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Problanco Electronics

Mexico . 6,409 parts In-Stock

1+ parts

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6,409

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Kulean Microsystems

USA . 1,682 parts In-Stock

1+ parts

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1,682

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UHIMA Technologies

Türkiye . 990 parts In-Stock

1+ parts

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990

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Speed Components Ltd (Excess)

Israel . 69 parts In-Stock

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69

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Overview

Boost your electronic projects with the NC7SZ157L6X-L22175 by Onsemi! This high-quality multiplexer offers fast propagation delay, low power consumption, and versatile applications in various industries. With Onsemi's reputation for reliability and innovation, you can trust that this product delivers exceptional performance and durability. Whether you're designing consumer electronics, automotive systems, or industrial equipment, the NC7SZ157L6X-L22175 provides value, efficiency, and precision to meet your project needs. Choose Onsemi for cutting-edge technology and superior quality in every component.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures efficient and fast signal processing.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards.

No. of Inputs: 2

Having 2 inputs provides flexibility in handling multiple input signals.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage, suitable for various applications.

Load Capacitance (CL): 50 pF

Capable of handling a moderate load capacitance without compromising performance.

Maximum Operating Temperature: 85 °C

Can operate reliably at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without issues.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Multiplexer & Demultiplexer NC7SZ157L6X-L22175 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NC7SZ157L6X-L22175 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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