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NC7SP157L6X

Onsemi

NC7SP157L6X by Onsemi

The Onsemi NC7SP157L6X is a CMOS multiplexer with 2 inputs, 47.7 ns propagation delay, and operates at supply voltages of 1.2V/3.3V. Ideal for industrial applications requiring fast switching and low power consumption in a small outline package with gold nickel terminals.

Median Price

$0.455

Lifecycle Status

EOL

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,370 parts In-Stock

1+ parts

$0.270

100+ parts

$0.260

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$0.260

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19,370

$0.270

$0.260

$0.260

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DigiKey

USA . 228,610 parts In-Stock

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$0.640

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$0.640

228,610

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-

$0.640

$0.640

Flip Electronics (Authorized)

USA . 227,810 parts In-Stock

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Vyrian

USA . 227,959 parts In-Stock

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Flip Electronics

USA . 222,810 parts In-Stock

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Chip Stock

USA . 10,540 parts In-Stock

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10,540

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Digiode

USA . 774 parts In-Stock

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774

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Nova Conductors

Japan . 300 parts In-Stock

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300

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NexGen Digital

USA . 18 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 228,164 parts In-Stock

1+ parts

$0.540

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-

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228,164

$0.540

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Corohmni

South Africa . 400 parts In-Stock

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$0.640

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400

$0.640

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Aztec Data Supply Inc.

USA . 3,045 parts In-Stock

1+ parts

$16.747

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3,045

$16.747

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Kulean Microsystems

USA . 8,324 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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SupplyDigital Components

Austria . 7,699 parts In-Stock

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Continental Prestige Electronics

USA . 6,138 parts In-Stock

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TANS Electronics

Latvia . 3,777 parts In-Stock

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Problanco Electronics

Mexico . 2,413 parts In-Stock

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Perfect Parts

USA . 2,397 parts In-Stock

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Argo Parts USA

USA . 2,215 parts In-Stock

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Microchip USA

USA . 1,719 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,512 parts In-Stock

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Corphita

USA . 1,004 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 479 parts In-Stock

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479

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Supply Digital

USA . 348 parts In-Stock

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348

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Overview

Enhance your electronic designs with the NC7SP157L6X by Onsemi, a high-quality multiplexer & demultiplexer that offers efficient signal routing. Manufactured by Onsemi, known for their reliable and innovative products, this component is ideal for applications requiring precise data selection. With a low propagation delay and small footprint, this product delivers fast and accurate performance. Upgrade your projects with the NC7SP157L6X and experience the value of superior functionality and enhanced efficiency.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 47.7 ns

Low propagation delay ensures fast switching speed, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing overall manufacturing costs.

No. of Inputs: 2

Having 2 inputs provides flexibility in routing signals and makes it suitable for various multiplexing applications.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a low supply voltage, which is ideal for battery-powered devices and low-power applications.

Load Capacitance (CL): 30 pF

Low load capacitance minimizes signal distortion and ensures accurate transmission of data.

Power Supplies (V): 1.2/3.3

Compatible with multiple power supply voltages, offering flexibility in system design and integration.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperatures, ensuring reliable performance in cold environments.

Technology: CMOS

CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Multiplexer & Demultiplexer NC7SP157L6X attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

P

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

.5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

47.7 ns

Propagation Delay (tpd):

47.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

GOLD NICKEL

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NC7SP157L6X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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