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NC7SV157L6X

Onsemi

NC7SV157L6X by Onsemi

The Onsemi NC7SV157L6X is a multiplexer & demultiplexer with 1 function and 2 inputs. It has a propagation delay of 18.8 ns and operates at a nominal voltage of 1.2V. This component is commonly used in industrial applications due to its small size and low power consumption.

Median Price

$0.230

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,191 parts In-Stock

1+ parts

$0.230

100+ parts

$0.117

1k+ parts

$0.097

10k+ parts

$0.087

4,191

$0.230

$0.117

$0.097

$0.087

Mouser Electronics

USA . 3,186 parts In-Stock

1+ parts

$0.230

100+ parts

$0.117

1k+ parts

$0.097

10k+ parts

$0.085

3,186

$0.230

$0.117

$0.097

$0.085

Adafruit Industries

USA . 300 parts In-Stock

1+ parts

$27.002

100+ parts

$24.572

1k+ parts

$22.142

10k+ parts

-

300

$27.002

$24.572

$22.142

-

Flip Electronics (Authorized)

USA . 240,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

240,000

-

-

-

-

Rochester

USA . 24,995 parts In-Stock

1+ parts

-

100+ parts

$0.104

1k+ parts

$0.087

10k+ parts

$0.077

24,995

-

$0.104

$0.087

$0.077

Verical

USA . 24,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.097

24,995

-

-

-

$0.097

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 555 parts In-Stock

1+ parts

$0.081

100+ parts

-

1k+ parts

-

10k+ parts

-

555

$0.081

-

-

-

Nova Conductors

Japan . 87 parts In-Stock

1+ parts

$0.235

100+ parts

-

1k+ parts

-

10k+ parts

-

87

$0.235

-

-

-

Flip Electronics

USA . 115,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

115,000

-

-

-

-

NexGen Digital

USA . 85,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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85,045

-

-

-

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Vyrian

USA . 49,678 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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49,678

-

-

-

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NAC Semi

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.076

10,000

-

-

-

$0.076

DigiKey Marketplace

USA . 6,658 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,658

-

-

-

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R&J Components

USA . 4,920 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,920

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 49,746 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

-

10k+ parts

-

49,746

$0.072

-

-

-

Corphita

USA . 327 parts In-Stock

1+ parts

$0.076

100+ parts

-

1k+ parts

-

10k+ parts

-

327

$0.076

-

-

-

Corohmni

South Africa . 461 parts In-Stock

1+ parts

$0.085

100+ parts

-

1k+ parts

-

10k+ parts

-

461

$0.085

-

-

-

Argo Parts USA

USA . 2,581 parts In-Stock

1+ parts

$0.235

100+ parts

-

1k+ parts

-

10k+ parts

$0.228

2,581

$0.235

-

-

$0.228

Continental Prestige Electronics

USA . 576 parts In-Stock

1+ parts

$0.235

100+ parts

-

1k+ parts

-

10k+ parts

$0.231

576

$0.235

-

-

$0.231

Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$27.002

100+ parts

$24.572

1k+ parts

$22.142

10k+ parts

-

300

$27.002

$24.572

$22.142

-

Lixinc

USA . 9,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,992

-

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Perfect Parts

USA . 6,859 parts In-Stock

1+ parts

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6,859

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-

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TANS Electronics

Latvia . 6,234 parts In-Stock

1+ parts

-

100+ parts

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6,234

-

-

-

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

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5,000

-

-

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SupplyDigital Components

Austria . 4,578 parts In-Stock

1+ parts

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4,578

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-

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Kulean Microsystems

USA . 4,049 parts In-Stock

1+ parts

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100+ parts

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4,049

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-

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iodParts Technologies Inc.

India . 2,880 parts In-Stock

1+ parts

-

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2,880

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Assy Fe

Spain . 1,941 parts In-Stock

1+ parts

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1,941

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Supply Digital

USA . 1,387 parts In-Stock

1+ parts

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1,387

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-

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Problanco Electronics

Mexico . 1,043 parts In-Stock

1+ parts

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1,043

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-

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Microchip USA

USA . 428 parts In-Stock

1+ parts

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428

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UHIMA Technologies

Türkiye . 343 parts In-Stock

1+ parts

-

100+ parts

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343

-

-

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-

Overview

Discover the NC7SV157L6X by Onsemi, the ultimate solution for your multiplexing and demultiplexing needs. With its superior quality and advanced technology, this product guarantees unmatched performance and reliability. Whether you're in the industrial sector or working on a personal project, this versatile device will exceed your expectations. Benefit from its fast propagation delay of 18.8 ns, making it ideal for applications requiring quick response times. The small outline and very thin profile package style ensure easy integration into any design. Experience the convenience and value this product offers – choose the NC7SV157L6X for seamless operation and exceptional results.

Feature Benefit Bullets

Propagation Delay:

18.8 ns - This low propagation delay ensures fast and efficient performance, making it suitable for time-sensitive applications.

Surface Mount:

YES - The surface mount capability allows for easy installation and space-saving integration into electronic circuits.

No. of Functions:

1 - With a single function, this multiplexer/demultiplexer provides simplicity and reliability in signal routing.

No. of Inputs:

2 - Having two inputs allows for versatile signal selection and routing options.

Package Shape:

RECTANGULAR - The rectangular shape of the package enables ease of handling and compatibility with standard PCB designs.

Nominal Supply Voltage / Vsup (V):

1.2 - The low nominal supply voltage enhances power efficiency while maintaining stable operation.

Load Capacitance (CL):

15 pF - The specified load capacitance ensures optimal signal integrity and compatibility with various electrical systems.

Power Supplies (V):

1.2/3.3 - The compatibility with both 1.2V and 3.3V power supplies offers flexibility and support for different voltage requirements.

No. of Terminals:

6 - The compact design with a limited number of terminals simplifies circuit connection and reduces complexity in system integration.

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE - The small outline and very thin profile packaging enable efficient space utilization and compatibility with miniaturized electronic devices.

Maximum I (ol):

2 Amp - The high maximum output current of 2 Amp allows the product to handle higher power loads without compromising performance.

Propagation Delay (tpd):

18.8 ns - The low propagation delay contributes to minimal signal latency, ensuring fast and precise data transmission.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature allows reliable operation even in harsh environmental conditions.

Minimum Operating Temperature:

40 °C - The wide range of minimum operating temperature ensures compatibility across various temperature conditions.

Terminal Finish:

GOLD NICKEL - The gold nickel terminal finish offers excellent corrosion resistance and reliable electrical conductivity, enhancing long-term durability.

Terminal Position:

DUAL - The dual terminal position provides flexibility in circuit board layout and allows for efficient signal routing.

Maximum Seated Height:

0.55 mm - The ultra-low maximum seated height enables compatibility with space-constrained applications and compact electronic devices.

Width:

1 mm - The compact width ensures easy integration into space-limited circuit designs.

Output Polarity:

TRUE - The true output polarity ensures accurate and consistent signal transmission without any inversion or distortion.

Minimum Supply Voltage (Vsup):

0.9 V - The low minimum supply voltage allows operation in low power scenarios while maintaining reliability and stability.

Maximum Time At Peak Reflow Temperature (s):

30 - This maximum time defines safe reflow conditions during assembly, ensuring proper soldering without damaging the device.

Peak Reflow Temperature °C:

260 - The specified peak reflow temperature establishes the maximum temperature limit during solder reflow processes.

Length:

1.45 mm - The compact length facilitates integration and compatibility in space-constrained electronic designs.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures reliable operation under extended temperature ranges typically encountered in industrial applications.

Technology:

CMOS - The CMOS technology employed in this product provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form:

NO LEAD - The no lead terminal form eliminates the risk of lead contamination and supports modern environmental regulations.

Packing Method:

TR - The tape and reel (TR) packing method simplifies automated assembly processes, reducing handling time and improving manufacturing efficiency.

Terminal Pitch:

0.5 mm - The narrow terminal pitch enables high-density PCB layouts, allowing for the integration of more components in limited space.

Moisture Sensitivity Level (MSL):

1 - The MSL 1 rating indicates that this product has unlimited floor life, making it suitable for long-term storage and handling ease.

Maximum Supply Voltage (Vsup):

3.6 V - The high maximum supply voltage provides compatibility with a wide range of power supply systems.

No. of Outputs:

1 - With a single output, this multiplexer/demultiplexer enables straightforward routing of selected signals, simplifying system configuration.

Technical Specifications

Multiplexer & Demultiplexer NC7SV157L6X attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

18.8 ns

Propagation Delay (tpd):

18.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

GOLD NICKEL

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NC7SV157L6X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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