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74LVC157APW,112

NXP Semiconductors

74LVC157APW,112 by NXP Semiconductors

NXP Semiconductors' 74LVC157APW,112 is a CMOS multiplexer with 4 functions and 2 inputs. It has a propagation delay of 6.5 ns at 3.3V, suitable for automotive applications due to its wide operating temperature range (-40 to 125 °C) and small form factor (5x4.4 mm).

Median Price

$0.279

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60,654 parts In-Stock

1+ parts

-

100+ parts

$0.290

1k+ parts

$0.241

10k+ parts

$0.215

60,654

-

$0.290

$0.241

$0.215

DigiKey

USA . 60,654 parts In-Stock

1+ parts

-

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$0.360

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60,654

-

-

$0.360

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Verical

USA . 40,800 parts In-Stock

1+ parts

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$0.268

40,800

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$0.268

Arrow

USA . 4,889 parts In-Stock

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$0.124

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4,889

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$0.124

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Distributors (In-Stock)

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Digiode

USA . 4,688 parts In-Stock

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$0.116

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$0.116

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Nova Conductors

Japan . 50 parts In-Stock

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$0.240

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50

$0.240

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Chip Stock

USA . 184,000 parts In-Stock

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DigiKey Marketplace

USA . 60,654 parts In-Stock

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$0.130

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60,654

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$0.130

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Vyrian

USA . 5,178 parts In-Stock

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VNN

France . 1,664 parts In-Stock

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Anansix

USA . 1,473 parts In-Stock

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Inventory MP

USA . 59 parts In-Stock

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Bristol Electronics

USA . 59 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 45,636 parts In-Stock

1+ parts

$0.104

100+ parts

$0.101

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$0.101

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45,636

$0.104

$0.101

$0.101

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Corphita

USA . 2,900 parts In-Stock

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$0.110

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$0.110

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AZTECH Wire

Italy . 9,539 parts In-Stock

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$0.140

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Argo Parts USA

USA . 4,438 parts In-Stock

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$0.240

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$0.233

4,438

$0.240

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$0.233

Aztec Data Supply Inc.

USA . 2,067 parts In-Stock

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$16.004

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$16.004

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Corohmni

South Africa . 543 parts In-Stock

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$25.299

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543

$25.299

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Continental Prestige Electronics

USA . 56,678 parts In-Stock

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$0.146

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Perfect Parts

USA . 30,551 parts In-Stock

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UNI Independent Distributors

Spain . 4,999 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Supply Digital

USA . 366 parts In-Stock

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Microchip USA

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Netroflash

USA . 100 parts In-Stock

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$0.235

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$0.228

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$0.223

100

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$0.223

Overview

Enhance your electronic designs with the high-quality 74LVC157APW,112 by NXP Semiconductors. This multiplexer & demultiplexer offers unparalleled performance and reliability, perfect for a wide range of applications. Experience fast propagation delays, low power consumption, and advanced CMOS technology. With a compact package style and temperature grade suitable for automotive use, this product is a must-have for your projects. Trust NXP Semiconductors to deliver cutting-edge solutions that exceed expectations. Upgrade your designs with the 74LVC157APW,112 today and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to environmental factors, making this product suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 6.5 ns

Low propagation delay ensures fast processing speed, making this multiplexer/demultiplexer ideal for high-speed data transmission applications.

Surface Mount: YES

Surface mount capability enables easy and convenient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 2.7

Operates at a low nominal voltage of 2.7V, which is suitable for low-power applications and helps in conserving energy.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand extreme thermal conditions, enhancing its reliability and durability.

Technology: CMOS

Utilizes CMOS technology, which offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it a versatile choice for various applications.

Technical Specifications

Multiplexer & Demultiplexer 74LVC157APW,112 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LVC157APW,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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