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74LVC1G157GW

NXP Semiconductors

74LVC1G157GW by NXP Semiconductors

The NXP Semiconductors 74LVC1G157GW is a CMOS multiplexer with a propagation delay of 6.3 ns and a load capacitance of 50 pF. It is commonly used in automotive applications due to its small size, low power consumption, and wide operating temperature range.

Median Price

$0.081

Lifecycle Status

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UK . 25,800 parts In-Stock

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Nova Conductors

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Next Level Components, LLC

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Ampacity Inc.

Singapore . 25,590 parts In-Stock

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Semicontronic

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AZTECH Wire

Italy . 7,610 parts In-Stock

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Microchip USA

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Advanced Electronics

New Zealand . 50 parts In-Stock

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Corohmni

South Africa . 3 parts In-Stock

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Overview

Looking for a high-quality multiplexer that delivers exceptional performance? Look no further than the 74LVC1G157GW by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors is known for its cutting-edge technology and reliable products. The 74LVC1G157GW is designed to meet the demands of various applications with its versatile functionality. With a compact package size and true output polarity, this multiplexer offers tremendous value to customers. Its fast propagation delay and wide operating temperature range ensure optimal performance in any condition. Trust NXP Semiconductors for all your multiplexing needs and experience the benefits of superior quality and reliability.

Feature Benefit Bullets

Propagation Delay at Nominal Supply: 6.3 ns

Provides fast and efficient signal transmission, reducing latency and ensuring quick response times.

Surface Mount: Yes

Allows for easy installation and integration into electronic devices, saving time and effort for the customer.

No. of Functions: 1

Offers a single multiplexer function, simplifying circuit design and reducing complexity for the customer.

No. of Inputs: 2

Supports dual input signals, providing versatility and flexibility in signal routing options.

Nominal Supply Voltage / Vsup (V): 1.8

Operates on a low supply voltage, minimizing power consumption and extending battery life in portable devices.

Load Capacitance (CL): 50 pF

Handles high capacitance loads effectively, ensuring stable and reliable signal transmission without distortion.

Logic IC Type: Multiplexer

Enables the selection and routing of multiple input signals to a single output, improving signal management and organization.

Power Supplies (V): 3.3

Accommodates a wide range of power supply voltages, making it compatible with various electronic systems and applications.

No. of Terminals: 6

Features a compact design with a limited number of terminals, saving space and simplifying circuit board layout.

Maximum I (ol): 24 Amp

Supports high output current capability, allowing for driving of demanding loads without compromising performance.

Propagation Delay (tpd): 13 ns

Ensures minimal delay in signal propagation, maintaining accurate timing and synchronization between different components.

Maximum Operating Temperature: 125 °C

Withstands high operating temperatures, making it suitable for automotive and industrial environments.

Minimum Operating Temperature: -40 °C

Operates reliably even in extremely cold temperatures, ensuring consistent performance in harsh conditions.

Terminal Finish: Tin (Sn)

Provides a durable and corrosion-resistant terminal finish, prolonging the product's lifespan and reducing maintenance requirements.

Width: 1.25 mm

Features a compact width, allowing for space-efficient integration into electronic devices with limited board space.

Output Polarity: TRUE

Maintains the original polarity of the output signal, ensuring accurate and reliable data transmission without inversion.

Minimum Supply Voltage (Vsup): 1.65 V

Supports operation with a low supply voltage, enabling compatibility with power-limited devices.

Peak Reflow Temperature (C): 260

Withstands high reflow temperatures during soldering processes, ensuring reliability and durability in manufacturing.

Length: 2 mm

Compact length enables easy installation and integration with other components, saving valuable space in electronic systems.

Technology: CMOS

Utilizes CMOS technology, providing low power consumption, high noise immunity, and fast switching speed for efficient performance.

Terminal Form: GULL WING

Terminal form ensures secure and reliable connections, minimizing the risk of signal loss or disruption due to loose connections.

Terminal Pitch: 0.65 mm

Offers a narrow terminal pitch, facilitating tight spacing between terminals and enhancing PCB design flexibility.

Moisture Sensitivity Level (MSL): 1

Resistant to moisture damage, ensuring long-term reliability in humid environments.

Maximum Supply Voltage (Vsup): 5.5 V

Supports operation with a high supply voltage, making it suitable for a wide range of applications.

No. of Outputs: 1

Provides a single output, simplifying circuit design and reducing complexity for the customer.

Technical Specifications

Multiplexer & Demultiplexer 74LVC1G157GW attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G157GW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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