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V62/04699-01XE

Texas Instruments

V62/04699-01XE by Texas Instruments

V62/04699-01XE by Texas Instruments is a 4-bit multiplexer with 38ns propagation delay, suitable for automotive applications. It operates at a nominal voltage of 5V, has 16 terminals in a small outline package, and supports up to 6V supply voltage. With surface mount capability and true output polarity, it offers efficient signal routing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,327 parts In-Stock

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2,327

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Digiode

USA . 1,456 parts In-Stock

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1,456

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Distributors (Availability)

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AZTECH Wire

Italy . 352 parts In-Stock

1+ parts

$7.058

100+ parts

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352

$7.058

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Microchip USA

USA . 4,969 parts In-Stock

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$8.408

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4,969

$8.408

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Parana Technologies

USA . 2,092 parts In-Stock

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$9.603

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$10.197

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2,092

$9.603

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$10.197

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DigiPath Technology Company

USA . 595 parts In-Stock

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$10.574

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$9.728

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595

$10.574

$9.728

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ChromeModa Solutions

Germany . 1,942 parts In-Stock

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$10.790

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$8.848

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1,942

$10.790

$8.848

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IDEA Electronic Components Group

UK . 23 parts In-Stock

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$10.790

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$10.250

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$9.711

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23

$10.790

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$9.711

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One Stop Electronics

USA . 890 parts In-Stock

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$11.000

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890

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Corphita

USA . 652 parts In-Stock

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Overview

Experience high-quality performance and reliability with the V62/04699-01XE by Texas Instruments, a cutting-edge Multiplexer & Demultiplexer designed to exceed your expectations. This versatile device offers unparalleled value and benefits for a wide range of applications, thanks to its advanced technology and innovative features. Trust in Texas Instruments' reputation for excellence and choose the V62/04699-01XE for all your multiplexing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, making it suitable for a variety of environments.

Propagation Delay At Nominal Supply: 38 ns

Low propagation delay ensures fast switching and efficient performance.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying assembly.

No. of Inputs: 4

Allows for multiple input signals to be processed efficiently.

No. of Bits: 4

Suitable for processing 4-bit data, making it ideal for a range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with many systems.

Output Characteristics: 3-STATE

Ability to control the output state, providing flexibility in circuit design and reducing power consumption.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers low power consumption and high noise immunity.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges, making it suitable for automotive applications.

Technical Specifications

Multiplexer & Demultiplexer V62/04699-01XE attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

335 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

V62/04699-01XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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