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V62/04659-01XE

Texas Instruments

V62/04659-01XE by Texas Instruments

V62/04659-01XE by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 5.4ns at 3.3V supply voltage. It operates in automotive-grade temperatures from -40 to 125°C and has a small outline package style for surface mount applications.

Median Price

$1.360

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 94 parts In-Stock

1+ parts

-

100+ parts

$1.360

1k+ parts

$1.130

10k+ parts

$1.010

94

-

$1.360

$1.130

$1.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,184 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

-

10k+ parts

-

1,184

$1.064

-

-

-

Vyrian

USA . 3,226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,226

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,230 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

-

4,230

$1.008

-

-

-

Parana Technologies

USA . 2,169 parts In-Stock

1+ parts

$29.393

100+ parts

-

1k+ parts

$58.872

10k+ parts

-

2,169

$29.393

-

$58.872

-

DigiPath Technology Company

USA . 859 parts In-Stock

1+ parts

$32.365

100+ parts

-

1k+ parts

-

10k+ parts

-

859

$32.365

-

-

-

ChromeModa Solutions

Germany . 5,796 parts In-Stock

1+ parts

$33.026

100+ parts

$27.081

1k+ parts

-

10k+ parts

-

5,796

$33.026

$27.081

-

-

IDEA Electronic Components Group

UK . 2,362 parts In-Stock

1+ parts

$33.026

100+ parts

$31.375

1k+ parts

$29.723

10k+ parts

-

2,362

$33.026

$31.375

$29.723

-

Microchip USA

USA . 4,012 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,012

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Overview

Enhance your electronic projects with the V62/04659-01XE Multiplexer & Demultiplexer by Texas Instruments. With a reputation for top-quality products, Texas Instruments delivers unmatched reliability and performance. This versatile component is ideal for a wide range of applications, offering customers value through its efficient operation and seamless integration. Upgrade your designs with the V62/04659-01XE and experience the benefits of precision engineering and innovation in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environmental conditions.

Propagation Delay At Nominal Supply: 5.4 ns

Low propagation delay ensures fast and efficient signal processing.

Surface Mount: YES

Surface mount capability makes it easier to integrate into electronic circuits.

No. of Functions: 4

Can handle multiple functions simultaneously, increasing efficiency.

No. of Inputs: 2

Suitable for applications requiring two input signals.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and space-saving in circuit layouts.

No. of Bits: 2

Suitable for processing binary data efficiently.

Nominal Supply Voltage / Vsup (V): 2.7

Operates at a standard voltage, ensuring compatibility with various electronic systems.

Load Capacitance (CL): 50 pF

Suitable for handling a standard load capacitance in electronic circuits.

Power Supplies (V): 3.3

Compatible with common power supply voltages, making it easy to incorporate into existing systems.

No. of Terminals: 16

Provides multiple connection points for versatility in circuit design.

Maximum I (ol): 24 Amp

Capable of handling high output currents, suitable for high-power applications.

Propagation Delay (tpd): 6.2 ns

Low propagation delay ensures fast signal processing for efficient operation.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, increasing versatility in application usage.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides a durable and corrosion-resistant finish for long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for flexibility in connection options.

Maximum Seated Height: 1.75 mm

Low profile design for space-saving in compact electronic devices.

Width: 3.9 mm

Compact width for easy integration into circuit layouts.

Output Polarity: TRUE

Ensures correct polarity in output signals for accurate data processing.

Minimum Supply Voltage (Vsup): 2 V

Can operate at lower supply voltages, increasing flexibility in power source options.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified amount of time, ensuring soldering reliability.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures for soldering processes.

Length: 9.9 mm

Compact length for space-saving in electronic device designs.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature requirements, suitable for automotive electronics.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form for easy surface mounting onto circuit boards.

Packing Method: TR

Tray packing method for secure transportation and storage of the product.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy connection to circuit boards.

Maximum Supply Voltage (Vsup): 3.6 V

Can operate at higher supply voltages, increasing versatility in power source options.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current requirement for efficient power consumption.

Technical Specifications

Multiplexer & Demultiplexer V62/04659-01XE attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

V62/04659-01XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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