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V62/04660-02YE

Texas Instruments

V62/04660-02YE by Texas Instruments

V62/04660-02YE by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 6.4ns at 3.3V supply. It operates in a temperature range of -55 to 125°C and features a small outline package style for military-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,758 parts In-Stock

1+ parts

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6,758

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Digiode

USA . 426 parts In-Stock

1+ parts

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426

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 806 parts In-Stock

1+ parts

$9.600

100+ parts

-

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806

$9.600

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Parana Technologies

USA . 832 parts In-Stock

1+ parts

$20.607

100+ parts

-

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$20.705

10k+ parts

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832

$20.607

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$20.705

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DigiPath Technology Company

USA . 1,842 parts In-Stock

1+ parts

$22.691

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1,842

$22.691

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ChromeModa Solutions

Germany . 3,660 parts In-Stock

1+ parts

$23.154

100+ parts

$18.986

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3,660

$23.154

$18.986

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IDEA Electronic Components Group

UK . 862 parts In-Stock

1+ parts

$23.154

100+ parts

$21.996

1k+ parts

$20.839

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862

$23.154

$21.996

$20.839

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One Stop Electronics

USA . 851 parts In-Stock

1+ parts

$37.000

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851

$37.000

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Corphita

USA . 4,701 parts In-Stock

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4,701

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Overview

Elevate your electronic projects with the V62/04660-02YE by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. As part of the Multiplexer & Demultiplexer category, this product offers unmatched reliability and precision. Whether you're designing advanced circuits or enhancing existing systems, this versatile device with 4 functions and 2 inputs will streamline your operations. With a compact design and fast propagation delay, it's the perfect solution for demanding applications. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for various applications.

Propagation Delay At Nominal Supply: 6.4 ns

The low propagation delay allows for fast data transmission and processing, making this multiplexer/demultiplexer efficient in time-critical applications.

Surface Mount: YES

The surface mount feature makes installation easy and convenient, especially in compact electronic devices or circuit boards.

No. of Functions: 4

With the ability to perform four different functions, this multiplexer/demultiplexer offers versatility and flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V makes this product energy-efficient and suitable for low-power applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the reliability and stability of the product in extreme conditions.

Technology: CMOS

The CMOS technology used in this product enables low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Multiplexer & Demultiplexer V62/04660-02YE attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.4 ns

Propagation Delay (tpd):

5.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

V62/04660-02YE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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