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SN74AS253N-10

Texas Instruments

SN74AS253N-10 by Texas Instruments

SN74AS253N-10 by Texas Instruments is a TTL technology multiplexer with 2 functions and 4 inputs. It operates at a supply voltage range of 4.5V to 5.5V, with a propagation delay of 11.5ns. Ideal for commercial applications requiring true output polarity and 3-state output characteristics in an inline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,584 parts In-Stock

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3,584

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Digiode

USA . 1,231 parts In-Stock

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1,231

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Distributors (Availability)

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AZTECH Wire

Italy . 769 parts In-Stock

1+ parts

$5.444

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769

$5.444

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Parana Technologies

USA . 1,760 parts In-Stock

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$26.967

100+ parts

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$30.653

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1,760

$26.967

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$30.653

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DigiPath Technology Company

USA . 810 parts In-Stock

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$29.694

100+ parts

$27.318

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810

$29.694

$27.318

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ChromeModa Solutions

Germany . 6,782 parts In-Stock

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$30.300

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$24.846

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6,782

$30.300

$24.846

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IDEA Electronic Components Group

UK . 1,502 parts In-Stock

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$30.300

100+ parts

$28.785

1k+ parts

$27.270

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1,502

$30.300

$28.785

$27.270

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One Stop Electronics

USA . 1,013 parts In-Stock

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$37.000

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1,013

$37.000

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Corphita

USA . 847 parts In-Stock

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847

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Overview

Unlock the power of efficient data transmission with the SN74AS253N-10 by Texas Instruments. This high-quality multiplexer/demultiplexer offers unparalleled performance and reliability, thanks to Texas Instruments' reputation for excellence in semiconductor manufacturing. Perfect for a wide range of applications, this versatile component provides customers with the value, benefits, and advantages they need to stay ahead in today's fast-paced tech world. Trust Texas Instruments to deliver superior quality and innovation with the SN74AS253N-10.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the multiplexer & demultiplexer.

No. of Functions: 2

Having 2 functions in one device allows for more efficient use of space and resources in a circuit design.

No. of Inputs: 4

With 4 inputs, this multiplexer & demultiplexer can handle multiple input signals simultaneously, increasing its versatility and applicability.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is common and easily accessible, making it compatible with many existing systems and power sources.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration and placement on a circuit board, optimizing space usage.

Propagation Delay (tpd): 11.5 ns

The low propagation delay of 11.5 ns ensures fast switching and minimal delay in signal processing, improving overall performance.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this multiplexer & demultiplexer is suitable for use in standard operating conditions, providing reliable functionality.

Technology: TTL

Using TTL technology ensures compatibility with TTL logic levels, making it easy to integrate into TTL-based systems and designs.

Technical Specifications

Multiplexer & Demultiplexer SN74AS253N-10 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AS

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

32 mA

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74AS253N-10 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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