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SN74HC153N-00

Texas Instruments

SN74HC153N-00 by Texas Instruments

The Texas Instruments SN74HC153N-00 is a CMOS multiplexer/demultiplexer with 2 functions and 4 inputs. It operates at a supply voltage range of 2V to 6V, with a propagation delay of 59ns. Ideal for industrial applications requiring true output polarity control in an inline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,494 parts In-Stock

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Digiode

USA . 593 parts In-Stock

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593

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Distributors (Availability)

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Parana Technologies

USA . 2,265 parts In-Stock

1+ parts

$16.187

100+ parts

$1,503.238

1k+ parts

$14.569

10k+ parts

-

2,265

$16.187

$1,503.238

$14.569

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AZTECH Wire

Italy . 762 parts In-Stock

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$16.292

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762

$16.292

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DigiPath Technology Company

USA . 863 parts In-Stock

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$17.824

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863

$17.824

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ChromeModa Solutions

Germany . 4,008 parts In-Stock

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$18.188

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$14.914

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4,008

$18.188

$14.914

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IDEA Electronic Components Group

UK . 1,857 parts In-Stock

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$18.188

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$17.279

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$16.369

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1,857

$18.188

$17.279

$16.369

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One Stop Electronics

USA . 848 parts In-Stock

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$54.000

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848

$54.000

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Corphita

USA . 2,269 parts In-Stock

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Overview

Enhance your electronic projects with the SN74HC153N-00 by Texas Instruments, a high-quality multiplexer & demultiplexer designed to streamline data transmission. With a reputation for excellence, Texas Instruments delivers products that guarantee reliability and precision. This versatile component offers customers the flexibility to choose between 2 functions and 4 inputs, making it ideal for a wide range of applications. Trust in Texas Instruments to provide innovative solutions that bring value and efficiency to your projects. Experience the benefits of the SN74HC153N-00 today and elevate your electronic designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the multiplexer & demultiplexer.

No. of Functions: 2

Can handle multiple functions efficiently, making it versatile for various applications.

No. of Inputs: 4

Allows for more input options, increasing flexibility in data routing and selection.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage requirement for easy integration into existing systems.

Propagation Delay (tpd): 59 ns

Low propagation delay ensures fast and efficient data processing.

Maximum Operating Temperature: 85 °C

Can function effectively in high temperature environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

Provides secure and reliable connections for easy installation and maintenance.

Technical Specifications

Multiplexer & Demultiplexer SN74HC153N-00 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

59 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74HC153N-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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