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74LVC257ADB,112

NXP Semiconductors

74LVC257ADB,112 by NXP Semiconductors

NXP Semiconductors' 74LVC257ADB,112 is a CMOS multiplexer with 4 functions and 2 inputs. It operates at a supply voltage of 2.7V to 3.6V, offering a propagation delay of 6ns and output current of 24A. Ideal for automotive applications due to its small outline package and wide temperature range from -40°C to 125°C.

Median Price

$0.505

Lifecycle Status

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Rochester

USA . 49,140 parts In-Stock

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$0.487

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$0.404

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$0.360

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$0.487

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Verical

USA . 40,404 parts In-Stock

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$0.505

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$0.450

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DigiKey

USA . 6,102 parts In-Stock

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$0.610

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Digiode

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TME

Poland . 300 parts In-Stock

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Chip Stock

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Vyrian

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DigiKey Marketplace

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Anansix

USA . 1,686 parts In-Stock

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VNN

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Nova Conductors

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Singapore . 31,602 parts In-Stock

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Corphita

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Component Stockers USA

USA . 9,845 parts In-Stock

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$0.160

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$0.180

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$0.180

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$0.180

AZTECH Wire

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Microchip USA

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$1.350

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$1.350

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$1.350

Corohmni

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$21.009

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Continental Prestige Electronics

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Perfect Parts

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Argo Parts USA

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UNI Independent Distributors

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Supply Digital

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Aranea Global

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iodParts Technologies Inc.

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Overview

Discover the powerful versatility of the 74LVC257ADB,112 from NXP Semiconductors. This high-quality multiplexer and demultiplexer offers unmatched performance and reliability for a wide range of applications. With its advanced technology and automotive-grade temperature grade, this product ensures optimal functionality even in the most demanding environments. Experience seamless operation and enhanced efficiency with the value-packed features of the 74LVC257ADB,112. Unlock endless possibilities with NXP Semiconductors' innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast and efficient signal processing in the multiplexer/demultiplexer.

Surface Mount: YES

Surface mount capability makes it easy to integrate this multiplexer/demultiplexer into circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Having 4 functions in one device increases versatility and functionality.

No. of Inputs: 2

Having 2 inputs allows for flexibility in signal routing and selection within the multiplexer/demultiplexer.

Nominal Supply Voltage / Vsup (V): 2.7

Operates at a nominal supply voltage of 2.7V, making it suitable for a wide range of applications.

Load Capacitance (CL): 50 pF

Designed to handle a load capacitance of 50 pF, ensuring stability in signal transmission.

Power Supplies (V): 3.3

Compatible with power supplies of 3.3V, which is commonly used in many electronic systems.

No. of Terminals: 16

Having 16 terminals provides ample connection points for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on the circuit board and allows for dense packing of components.

Maximum I (ol): 24 Amp

Can handle a maximum output current of 24A, making it suitable for demanding applications.

Propagation Delay (tpd): 7 ns

Low propagation delay of 7 ns ensures minimal signal delay in the multiplexing/demultiplexing process.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments up to 125°C, making it suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

3-state output capability allows for high impedance output, providing flexibility in signal routing.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments down to -40°C, suitable for outdoor and cold temperature applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish ensures good conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal position allows for secure and stable connection to the circuit board.

Maximum Seated Height: 2 mm

Low seated height of 2 mm saves space and allows for compact design.

Width: 5.3 mm

Compact width of 5.3 mm facilitates easy integration into circuit board layouts.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and processing.

Minimum Supply Voltage (Vsup): 1.2 V

Can operate at a minimum supply voltage of 1.2V, allowing for flexibility in power supply selection.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds, ensuring durability during soldering processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable soldering and component connection.

Length: 6.2 mm

Compact length of 6.2 mm allows for space-efficient placement on the circuit board.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range makes it suitable for use in automotive electronics applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure mounting on the circuit board.

Packing Method: TUBE

Tube packing method ensures safe transportation and storage of the multiplexer/demultiplexer components.

Terminal Pitch: 0.65 mm

Terminal pitch of 0.65 mm facilitates easy connection and soldering to the circuit board.

Maximum Supply Voltage (Vsup): 3.6 V

Can handle a maximum supply voltage of 3.6V, providing a wide range of power supply compatibility.

Technical Specifications

Multiplexer & Demultiplexer 74LVC257ADB,112 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74LVC257ADB,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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