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SNJ54AS353J

Texas Instruments

SNJ54AS353J by Texas Instruments

SNJ54AS353J by Texas Instruments is a TTL technology multiplexer with 2 functions, 4 inputs, and 16 terminals. It operates at temperatures ranging from -55 to 125 °C and has a propagation delay of 14 ns. Ideal for military applications due to its MIL-Grade screening level and ceramic package material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,213 parts In-Stock

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Digiode

USA . 3,334 parts In-Stock

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3,334

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Distributors (Availability)

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AZTECH Wire

Italy . 188 parts In-Stock

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$5.865

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$5.865

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Parana Technologies

USA . 571 parts In-Stock

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$13.684

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$14.182

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571

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DigiPath Technology Company

USA . 188 parts In-Stock

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$15.068

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$15.068

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IDEA Electronic Components Group

UK . 1,974 parts In-Stock

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$15.375

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$14.606

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$13.838

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1,974

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$14.606

$13.838

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ChromeModa Solutions

Germany . 1,679 parts In-Stock

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$15.375

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$12.608

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One Stop Electronics

USA . 1,064 parts In-Stock

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$58.000

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Corphita

USA . 4,513 parts In-Stock

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Overview

Upgrade your electronic designs with the SNJ54AS353J by Texas Instruments, a high-quality multiplexer & demultiplexer component that is sure to enhance the performance of your circuits. Designed with precision and reliability in mind, this product offers fast propagation delay and 3-state output characteristics. Perfect for military-grade applications, this Texas Instruments gem provides 2 functions, 4 inputs, and a maximum power supply current of 31 mA. Trust in the expertise of Texas Instruments and take your projects to the next level with the SNJ54AS353J!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent thermal properties and reliability, making this product suitable for high temperature environments and ensuring long-term durability.

Propagation Delay At Nominal Supply: 14 ns

Low propagation delay ensures fast signal processing and high-speed operation, making this product efficient for time-sensitive applications.

No. of Functions: 2

Having multiple functions in a single device reduces the need for additional components, saving space and simplifying circuit design.

No. of Inputs: 4

With 4 inputs, this multiplexer & demultiplexer offers versatile data routing capabilities, enabling efficient data transmission and signal management.

Nominal Supply Voltage / Vsup (V): 5

Operating at a commonly used supply voltage of 5V, this product is compatible with a wide range of systems and easy to integrate into existing circuits.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environments and extended product lifespan, making it suitable for industrial and military applications.

Technology: TTL

Employing TTL technology provides compatibility with TTL logic levels, ensuring seamless integration with other TTL-based systems and simplifying circuit design.

Technical Specifications

Multiplexer & Demultiplexer SNJ54AS353J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

31 mA

Propagation Delay At Nominal Supply:

14 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNJ54AS353J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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