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SN54HC604FH

Texas Instruments

SN54HC604FH by Texas Instruments

The Texas Instruments SN54HC604FH is an 8-function CMOS multiplexer with 2 inputs, operating b/w -55°C to 125°C. It features a chip carrier package style with 28 terminals and offers 3-STATE output characteristics. Ideal for military-grade applications requiring high temperature tolerance and precise signal routing in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,518

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-

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Digiode

USA . 2,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,320

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 384 parts In-Stock

1+ parts

$14.916

100+ parts

-

1k+ parts

-

10k+ parts

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384

$14.916

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Parana Technologies

USA . 1,053 parts In-Stock

1+ parts

$22.440

100+ parts

$2,083.937

1k+ parts

$20.196

10k+ parts

-

1,053

$22.440

$2,083.937

$20.196

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DigiPath Technology Company

USA . 2,300 parts In-Stock

1+ parts

$24.710

100+ parts

-

1k+ parts

-

10k+ parts

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2,300

$24.710

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IDEA Electronic Components Group

UK . 2,360 parts In-Stock

1+ parts

$25.214

100+ parts

$23.953

1k+ parts

$22.693

10k+ parts

-

2,360

$25.214

$23.953

$22.693

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ChromeModa Solutions

Germany . 2,179 parts In-Stock

1+ parts

$25.214

100+ parts

$20.675

1k+ parts

-

10k+ parts

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2,179

$25.214

$20.675

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One Stop Electronics

USA . 383 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

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10k+ parts

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383

$27.000

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Corphita

USA . 2,778 parts In-Stock

1+ parts

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100+ parts

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2,778

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Overview

Looking to streamline your circuit design with high-quality components? Look no further than the SN54HC604FH by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch multiplexer & demultiplexer solutions that are versatile and reliable. With 8 functions and 2 inputs, this chip carrier package offers military-grade performance in a compact square shape. Whether you're working on aerospace, defense, or industrial applications, the SN54HC604FH provides the value, benefits, and advantages you need to succeed. Upgrade your projects today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and high strength, making it ideal for high temperature applications.

Surface Mount: YES

Surface mount technology allows for easy and compact assembly, saving space on the PCB.

No. of Functions: 8

Being able to handle 8 functions in a single device increases efficiency and simplifies circuit design.

No. of Inputs: 2

Having 2 inputs allows for flexibility in routing signals within the circuit.

Package Shape: SQUARE

Square package shape is efficient for space utilization and allows for easy placement on the PCB.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for various applications.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and offers good thermal performance for reliable operation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can sustain harsh environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for the high impedance state, which is useful for bus systems and minimizing power consumption.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature makes this product suitable for cold environments.

Terminal Position: QUAD

Quad terminal position facilitates easy connection and compatibility with other components.

Temperature Grade: MILITARY

Military-grade temperature ratings ensure reliability and performance in demanding applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation speed.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product allows for precise and compact PCB layout.

Technical Specifications

Multiplexer & Demultiplexer SN54HC604FH attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N28

Logic IC Type:

No. of Functions:

8

No. of Inputs:

2

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN54HC604FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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