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8414101FA

Texas Instruments

8414101FA by Texas Instruments

8414101FA by Texas Instruments is a ceramic/glass-sealed multiplexer with 8 inputs, operating at 5V. Featuring a propagation delay of 36ns, it is ideal for military applications requiring high-speed data processing in harsh environments. With a temperature range of -55 to 125°C, this TTL technology device offers reliable performance in extreme conditions.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,130 parts In-Stock

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Digiode

USA . 4,057 parts In-Stock

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Anansix

USA . 1,934 parts In-Stock

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Native Components

USA . 96 parts In-Stock

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$2.020

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96

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Northwest PG Solutions

USA . 1,486 parts In-Stock

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$2.222

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$2.222

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AZTECH Wire

Italy . 895 parts In-Stock

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$10.304

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895

$10.304

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Parana Technologies

USA . 456 parts In-Stock

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$29.819

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$63.627

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456

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DigiPath Technology Company

USA . 2,203 parts In-Stock

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$32.834

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$30.207

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$32.834

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ChromeModa Solutions

Germany . 3,155 parts In-Stock

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$33.504

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$27.473

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IDEA Electronic Components Group

UK . 2,026 parts In-Stock

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$33.504

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$31.829

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$30.154

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2,026

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One Stop Electronics

USA . 1,412 parts In-Stock

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$37.000

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Corphita

USA . 1,200 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments 8414101FA multiplexer & demultiplexer. Crafted with quality ceramic and glass-sealed materials, this versatile component offers seamless integration with a wide range of applications. With a fast propagation delay of just 36ns, military-grade temperature tolerance, and a compact flatpack design, this product delivers reliable performance in demanding environments. Trust Texas Instruments for superior technology that brings value, efficiency, and innovation to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliability in harsh environments.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying the assembly process.

No. of Inputs: 8

Allows for multiple input signals to be processed efficiently, making it suitable for complex systems.

Propagation Delay (tpd): 36 ns

Offers fast signal processing, contributing to high-speed performance of the multiplexer/demultiplexer.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures without experiencing performance issues, suitable for a wide range of applications.

Technology: TTL

Utilizes Transistor-Transistor Logic technology known for its high speed and reliability, ensuring accurate data transmission.

Technical Specifications

Multiplexer & Demultiplexer 8414101FA attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-GDFP-F16

Length:

10.16 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Propagation Delay (tpd):

36 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Sub-Category:

Multiplexer/Demultiplexer

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.73 mm

Trade Compliance

8414101FA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-350-8782, 5962013508782

NIIN

013508782

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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