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SN74AHCT158PWG4

Texas Instruments

SN74AHCT158PWG4 by Texas Instruments

SN74AHCT158PWG4 by Texas Instruments is a CMOS multiplexer with 4 functions, 2 inputs, and 9.8 ns propagation delay at 5V. It has a small outline package suitable for industrial applications requiring inverted output polarity and operates b/w -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,113 parts In-Stock

1+ parts

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6,113

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Digiode

USA . 4,867 parts In-Stock

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4,867

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,504 parts In-Stock

1+ parts

$8.365

100+ parts

$776.827

1k+ parts

$7.529

10k+ parts

-

1,504

$8.365

$776.827

$7.529

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DigiPath Technology Company

USA . 2,315 parts In-Stock

1+ parts

$9.211

100+ parts

$8.474

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-

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2,315

$9.211

$8.474

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IDEA Electronic Components Group

UK . 1,046 parts In-Stock

1+ parts

$9.399

100+ parts

$8.929

1k+ parts

$8.459

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-

1,046

$9.399

$8.929

$8.459

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ChromeModa Solutions

Germany . 218 parts In-Stock

1+ parts

$9.399

100+ parts

$7.707

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-

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218

$9.399

$7.707

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AZTECH Wire

Italy . 632 parts In-Stock

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$10.954

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632

$10.954

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One Stop Electronics

USA . 189 parts In-Stock

1+ parts

$37.000

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189

$37.000

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Corphita

USA . 1,409 parts In-Stock

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Overview

Elevate your electronic projects with the SN74AHCT158PWG4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This multiplexer/demultiplexer offers versatile functionality with its 4 functions and 2 inputs, making it a valuable asset for a wide range of applications. With a fast propagation delay of 9.8 ns and a low load capacitance of 50 pF, this component ensures optimal performance and efficiency. Trust in Texas Instruments to provide reliable solutions for your projects, and experience the benefits of superior quality and precision engineering with the SN74AHCT158PWG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 9.8 ns

The low propagation delay at nominal supply ensures fast data transmission, making this multiplexer/demultiplexer suitable for applications requiring quick response times.

Surface Mount: YES

Being surface mount enables easy installation and integration onto PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is standard and compatible with many electronic systems, ensuring easy integration and operation.

No. of Functions: 4

With the ability to perform 4 functions, this multiplexer/demultiplexer offers versatility and can handle multiple inputs and outputs efficiently.

Technical Specifications

Multiplexer & Demultiplexer SN74AHCT158PWG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.8 ns

Propagation Delay (tpd):

9.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74AHCT158PWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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