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SN74S253FN

Texas Instruments

SN74S253FN by Texas Instruments

SN74S253FN by Texas Instruments is a TTL technology chip carrier with 2 functions and 4 inputs. It operates at a supply voltage of 5V, has a propagation delay of 18ns, and features 3-STATE output characteristics. Ideal for multiplexing/demultiplexing applications in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,787 parts In-Stock

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7,787

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Digiode

USA . 2,194 parts In-Stock

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2,194

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 907 parts In-Stock

1+ parts

$10.000

100+ parts

-

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907

$10.000

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AZTECH Wire

Italy . 274 parts In-Stock

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$17.100

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274

$17.100

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Parana Technologies

USA . 514 parts In-Stock

1+ parts

$21.393

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-

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$21.736

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514

$21.393

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$21.736

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DigiPath Technology Company

USA . 722 parts In-Stock

1+ parts

$23.556

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722

$23.556

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ChromeModa Solutions

Germany . 3,137 parts In-Stock

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$24.037

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$19.710

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3,137

$24.037

$19.710

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IDEA Electronic Components Group

UK . 1,754 parts In-Stock

1+ parts

$24.037

100+ parts

$22.835

1k+ parts

$21.633

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1,754

$24.037

$22.835

$21.633

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Corphita

USA . 1,443 parts In-Stock

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1,443

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Overview

Enhance your electronic projects with the SN74S253FN by Texas Instruments, a high-quality multiplexer & demultiplexer designed to streamline your circuit designs. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust in the reliability and performance of this product. From data transmission to signal routing, this versatile component offers endless applications. Experience the value and efficiency it brings to your projects, providing seamless operation and precise output control. Upgrade your electronics with the SN74S253FN and unlock a world of possibilities in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer/demultiplexer.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

No. of Functions: 2

Provides flexibility for multiple functions within a single component.

No. of Inputs: 4

Allows for multiple input sources to be processed efficiently.

Nominal Supply Voltage / Vsup (V): 5

Compatible with commonly used supply voltages in electronic circuits.

Propagation Delay (tpd): 18 ns

Offers fast processing speeds for time-sensitive applications.

Temperature Grade: COMMERCIAL

Suitable for standard commercial use and operating temperatures.

Technology: TTL

Utilizes TTL technology for reliable and consistent performance.

Technical Specifications

Multiplexer & Demultiplexer SN74S253FN attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

70 mA

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.9662 mm

Trade Compliance

SN74S253FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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