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SN74LS356FN3

Texas Instruments

SN74LS356FN3 by Texas Instruments

SN74LS356FN3 by Texas Instruments is an 8-input TTL multiplexer with 3-STATE output. Operating temperature range of 0°C to 70°C, it comes in a square chip carrier package with J bend terminals. Ideal for commercial applications requiring high-speed data switching in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,928 parts In-Stock

1+ parts

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4,928

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Vyrian

USA . 2,088 parts In-Stock

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2,088

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 147 parts In-Stock

1+ parts

$15.326

100+ parts

-

1k+ parts

$15.718

10k+ parts

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147

$15.326

-

$15.718

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DigiPath Technology Company

USA . 2,232 parts In-Stock

1+ parts

$16.876

100+ parts

$15.526

1k+ parts

-

10k+ parts

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2,232

$16.876

$15.526

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ChromeModa Solutions

Germany . 2,596 parts In-Stock

1+ parts

$17.220

100+ parts

$14.120

1k+ parts

-

10k+ parts

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2,596

$17.220

$14.120

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IDEA Electronic Components Group

UK . 1,051 parts In-Stock

1+ parts

$17.220

100+ parts

$16.359

1k+ parts

$15.498

10k+ parts

-

1,051

$17.220

$16.359

$15.498

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AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$18.287

100+ parts

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570

$18.287

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One Stop Electronics

USA . 1,212 parts In-Stock

1+ parts

$28.000

100+ parts

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1,212

$28.000

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Corphita

USA . 1,878 parts In-Stock

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1,878

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Overview

Unlock the power of efficient data processing with the SN74LS356FN3 by Texas Instruments. This high-quality multiplexer & demultiplexer offers unmatched reliability and performance for a wide range of applications. With its advanced technology and commercial-grade temperature grade, this product delivers exceptional value to customers seeking seamless data management solutions. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to heat, making this product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and secure installation onto circuit boards, saving space and simplifying assembly.

No. of Inputs: 8

Having 8 inputs allows for efficient multiplexing and demultiplexing of data or signals, providing flexibility in routing and managing information.

Package Shape: SQUARE

Square package shape helps in efficient placement and utilization of space on the PCB, enhancing overall design and layout.

No. of Terminals: 20

With 20 terminals, this product offers ample connectivity options for interfacing with other components or systems.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides protection and easy handling of the integrated circuits, ensuring reliability and convenience.

Maximum Operating Temperature: 70 °C

Ability to operate at up to 70°C makes this product suitable for a wide range of temperature conditions, ensuring consistent performance.

Output Characteristics: 3-STATE

3-state output characteristics allow for high impedance state when not active, reducing signal interference and improving signal integrity.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures functionality even in colder environments, increasing the product's versatility.

Terminal Position: QUAD

Quad terminal position aids in easy and secure connection to the PCB, enabling stable and reliable operation.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions, making this product suitable for commercial applications.

Technology: TTL

TTL technology offers fast switching speeds and high noise immunity, enhancing the overall performance and reliability of the product.

Terminal Form: J BEND

J Bend terminal form facilitates easy insertion and removal during PCB assembly, streamlining the manufacturing process.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27 mm provides adequate spacing for connections, reducing the risk of short circuits and ensuring proper signal transmission.

Technical Specifications

Multiplexer & Demultiplexer SN74LS356FN3 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74LS356FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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