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SNJ54HC356FK-00

Texas Instruments

SNJ54HC356FK-00 by Texas Instruments

SNJ54HC356FK-00 by Texas Instruments is a CMOS multiplexer with 8 inputs, 3-STATE output, and 97 ns propagation delay. It operates in a temperature range of -55 to 125°C and has a supply voltage range of 2-6V. Ideal for military-grade applications requiring high-speed signal switching in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,968 parts In-Stock

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Digiode

USA . 3,958 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,310 parts In-Stock

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$12.000

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$12.000

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AZTECH Wire

Italy . 629 parts In-Stock

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$16.320

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629

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Parana Technologies

USA . 1,446 parts In-Stock

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$17.186

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$17.403

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$17.186

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DigiPath Technology Company

USA . 362 parts In-Stock

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$18.924

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$17.410

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362

$18.924

$17.410

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ChromeModa Solutions

Germany . 2,671 parts In-Stock

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$19.310

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$15.834

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$19.310

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IDEA Electronic Components Group

UK . 2,017 parts In-Stock

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$19.310

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$18.344

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$17.379

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2,017

$19.310

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Corphita

USA . 2,937 parts In-Stock

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Overview

Enhance your electronic designs with the SNJ54HC356FK-00 by Texas Instruments, a top-tier manufacturer known for quality and reliability. As a versatile Multiplexer & Demultiplexer, this product offers exceptional performance and precision in a compact square chip carrier package. With 8 inputs, 3-STATE output characteristics, and a wide temperature range, it is perfect for a variety of applications in military-grade technology. Trust Texas Instruments to deliver superior products that provide value and efficiency to meet all your electronic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides high durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Enables easy and quick installation on PCBs, saving time and effort during assembly.

No. of Inputs: 8

Allows for multiple input signals to be multiplexed efficiently, increasing the flexibility and functionality of the product.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common voltage level, making it compatible with standard power sources.

Output Characteristics: 3-STATE

Supports tri-state logic, which enhances the versatility of the output signals and allows for more complex signal routing.

Technology: CMOS

Uses CMOS technology, known for its low power consumption and high noise immunity, ensuring efficient and reliable operation.

Temperature Grade: MILITARY

Designed to withstand extreme temperature conditions, making it ideal for military or industrial applications that require high reliability.

Technical Specifications

Multiplexer & Demultiplexer SNJ54HC356FK-00 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

TRANSPARENT ADDRESS LATCHES; 3 ENABLE INPUTS; REGISTERED DATA INPUTS

Family:

HC/UH

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

97 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54HC356FK-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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