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SNJ54152AW

Texas Instruments

SNJ54152AW by Texas Instruments

SNJ54152AW by Texas Instruments is an 8-input TTL multiplexer with a propagation delay of 30 ns. Operating temperature range from -55 to 125 °C makes it suitable for military applications. With a package style of FLATPACK, it has a max supply voltage of 5.5 V and load capacitance of 15 pF.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,209 parts In-Stock

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7,209

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Digiode

USA . 2,359 parts In-Stock

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2,359

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 13 parts In-Stock

1+ parts

$9.232

100+ parts

-

1k+ parts

$9.870

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13

$9.232

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$9.870

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DigiPath Technology Company

USA . 117 parts In-Stock

1+ parts

$10.166

100+ parts

$9.352

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-

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117

$10.166

$9.352

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ChromeModa Solutions

Germany . 1,138 parts In-Stock

1+ parts

$10.373

100+ parts

$8.506

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1,138

$10.373

$8.506

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IDEA Electronic Components Group

UK . 308 parts In-Stock

1+ parts

$10.373

100+ parts

$9.854

1k+ parts

$9.336

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308

$10.373

$9.854

$9.336

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AZTECH Wire

Italy . 228 parts In-Stock

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$14.812

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228

$14.812

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One Stop Electronics

USA . 505 parts In-Stock

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$36.000

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505

$36.000

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Corphita

USA . 693 parts In-Stock

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693

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Overview

Discover the Texas Instruments SNJ54152AW, a high-quality multiplexer & demultiplexer designed for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, this product offers unmatched value and reliability. Ideal for projects requiring precise signal routing and control, the SNJ54152AW provides customers with the performance they need to succeed. Experience the benefits of Texas Instruments technology and elevate your designs with this top-of-the-line component.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection against external elements, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and enhancing convenience.

No. of Inputs: 8

Offers flexibility and versatility in handling multiple input signals efficiently.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage levels, ensuring seamless integration into existing systems.

Propagation Delay (tpd): 30 ns

Provides fast signal processing, improving the overall performance of the multiplexer/demultiplexer.

Technical Specifications

Multiplexer & Demultiplexer SNJ54152AW attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F14

Length:

9.21 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

43 mA

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.03 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.29 mm

Trade Compliance

SNJ54152AW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-242-2721, 5962002422721

NIIN

002422721

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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