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SNC54HC153FH

Texas Instruments

SNC54HC153FH by Texas Instruments

SNC54HC153FH by Texas Instruments is a CMOS multiplexer with 2 functions, 4 inputs, and operates b/w -55 to 125°C. It comes in a ceramic chip carrier package with 20 terminals and is suitable for military applications requiring MIL-STD-883 Class B screening.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,372 parts In-Stock

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Digiode

USA . 1,004 parts In-Stock

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1,004

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Distributors (Availability)

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AZTECH Wire

Italy . 407 parts In-Stock

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$5.300

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407

$5.300

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Parana Technologies

USA . 1,737 parts In-Stock

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$13.447

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$13.963

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1,737

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$13.963

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IDEA Electronic Components Group

UK . 1,593 parts In-Stock

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$15.109

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$14.354

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$13.598

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1,593

$15.109

$14.354

$13.598

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ChromeModa Solutions

Germany . 957 parts In-Stock

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$15.109

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$12.389

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957

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One Stop Electronics

USA . 1,541 parts In-Stock

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$38.000

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$38.000

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DigiPath Technology Company

USA . 2,016 parts In-Stock

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$13.622

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Corphita

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Overview

Looking for a high-quality multiplexer and demultiplexer solution? Look no further than the SNC54HC153FH by Texas Instruments. With a reputation for excellence in manufacturing, this product offers unmatched reliability and performance. Ideal for a wide range of applications, this versatile chip carrier package boasts 2 functions, 4 inputs, and a military-grade temperature rating. Trust Texas Instruments to deliver top-notch quality and innovation. Upgrade your circuitry with the SNC54HC153FH today!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides high thermal conductivity and good mechanical strength, making it suitable for high temperature and rugged environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and improving overall performance.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, simplifying the overall design and saving on cost.

Screening Level: MIL-STD-883 Class B (Modified)

Military standard screening ensures high reliability and durability, making it ideal for critical applications.

No. of Inputs: 4

Having multiple inputs allows for versatile signal routing and processing, making the device more flexible in different applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the device can withstand extreme heat conditions, ensuring reliable performance in harsh environments.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature allows the device to function even in extremely cold conditions, increasing its usability in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable in signal processing.

Technical Specifications

Multiplexer & Demultiplexer SNC54HC153FH attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNC54HC153FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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