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74CBTLV16292GRE4

Texas Instruments

74CBTLV16292GRE4 by Texas Instruments

74CBTLV16292GRE4 by Texas Instruments is a 12-function multiplexer with a supply voltage of 2.5V, operating temperature range of -40 to 85°C, and propagation delay of 0.25ns. Ideal for industrial applications requiring high-speed signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,096 parts In-Stock

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Digiode

USA . 1,034 parts In-Stock

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1,034

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One Stop Electronics

USA . 1,373 parts In-Stock

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$14.000

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$14.000

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AZTECH Wire

Italy . 336 parts In-Stock

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$14.747

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Parana Technologies

USA . 2,081 parts In-Stock

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$19.524

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$19.528

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$19.524

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DigiPath Technology Company

USA . 31 parts In-Stock

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$21.498

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31

$21.498

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ChromeModa Solutions

Germany . 4,836 parts In-Stock

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$21.937

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$17.988

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4,836

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$17.988

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IDEA Electronic Components Group

UK . 605 parts In-Stock

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$21.937

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$20.840

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$19.743

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605

$21.937

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$19.743

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Native Components

USA . 514 parts In-Stock

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$69.190

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$66.422

514

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$66.422

Northwest PG Solutions

USA . 1,165 parts In-Stock

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$76.109

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Corphita

USA . 509 parts In-Stock

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iodParts Technologies Inc.

India . 160 parts In-Stock

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Overview

Enhance your electronics design with the 74CBTLV16292GRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality multiplexer & demultiplexer components that provide exceptional performance and reliability. This versatile product offers a wide range of applications, ensuring flexibility in your projects. With a focus on value and customer satisfaction, this component boasts fast propagation delay, low power consumption, and a compact design for seamless integration. Upgrade your circuits with confidence using the 74CBTLV16292GRE4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy installation onto circuit boards, saving time and effort during assembly.

No. of Functions: 12

With 12 functions in one device, this multiplexer/demultiplexer offers versatile and efficient signal routing capabilities.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a low voltage of 2.5V helps in reducing power consumption and heat dissipation.

Propagation Delay (tpd): 0.25 ns

A low propagation delay of 0.25 nanoseconds ensures fast and efficient data transmission within the device.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and industrial settings.

Technical Specifications

Multiplexer & Demultiplexer 74CBTLV16292GRE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

CBTLV/3B

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

12

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

74CBTLV16292GRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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