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74CB3T3253DGVRG4

Texas Instruments

74CB3T3253DGVRG4 by Texas Instruments

Texas Instruments 74CB3T3253DGVRG4 is a CMOS multiplexer/demultiplexer with 2 functions, 16 terminals, and 4 outputs. Operating at -40 to 85°C, it has a propagation delay of 0.25 ns and supports supply voltages from 2.3V to 3.6V. Ideal for industrial applications requiring high-speed signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,957 parts In-Stock

1+ parts

-

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5,957

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Digiode

USA . 460 parts In-Stock

1+ parts

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460

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 961 parts In-Stock

1+ parts

$0.094

100+ parts

-

1k+ parts

-

10k+ parts

$0.091

961

$0.094

-

-

$0.091

Northwest PG Solutions

USA . 2,336 parts In-Stock

1+ parts

$0.104

100+ parts

-

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-

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$0.092

2,336

$0.104

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-

$0.092

Parana Technologies

USA . 1,159 parts In-Stock

1+ parts

$12.150

100+ parts

$1,128.338

1k+ parts

$10.935

10k+ parts

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1,159

$12.150

$1,128.338

$10.935

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DigiPath Technology Company

USA . 972 parts In-Stock

1+ parts

$13.379

100+ parts

-

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972

$13.379

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ChromeModa Solutions

Germany . 5,883 parts In-Stock

1+ parts

$13.652

100+ parts

$11.195

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-

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5,883

$13.652

$11.195

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IDEA Electronic Components Group

UK . 1,885 parts In-Stock

1+ parts

$13.652

100+ parts

$12.969

1k+ parts

$12.287

10k+ parts

-

1,885

$13.652

$12.969

$12.287

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AZTECH Wire

Italy . 834 parts In-Stock

1+ parts

$18.148

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834

$18.148

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One Stop Electronics

USA . 567 parts In-Stock

1+ parts

$35.000

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567

$35.000

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Corphita

USA . 3,410 parts In-Stock

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3,410

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Overview

Looking for a reliable multiplexer & demultiplexer for your project? Look no further than the 74CB3T3253DGVRG4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch performance and durability. This versatile component is perfect for a wide range of applications, offering customers unmatched value and benefits. Whether you're working on industrial automation or telecommunications, this product will meet all your needs with its advanced technology and efficient design. Upgrade your project with the 74CB3T3253DGVRG4 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components of the multiplexer/demultiplexer.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing the overall size of the system.

No. of Functions: 2

Provides the capability to combine or separate two signals, increasing the flexibility and functionality of the device.

Propagation Delay (tpd): 0.25 ns

Offers fast signal processing and transmission, ensuring quick and efficient data transfer within the system.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments where temperature fluctuations are common, ensuring reliability and stability in operation.

No. of Outputs: 4

Allows for multiple output signals to be generated from the input, enabling the device to handle a larger volume of data.

Technical Specifications

Multiplexer & Demultiplexer 74CB3T3253DGVRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

CB3T/3VT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Outputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.6 mm

Trade Compliance

74CB3T3253DGVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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