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SN74ALS157ADRE4

Texas Instruments

SN74ALS157ADRE4 by Texas Instruments

SN74ALS157ADRE4 by Texas Instruments is a TTL multiplexer with 4 functions and 2 inputs. It has a propagation delay of 14 ns at 5V, making it ideal for fast switching applications. With a small outline package style and surface mount capability, it is suitable for compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,598 parts In-Stock

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8,598

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Digiode

USA . 4,297 parts In-Stock

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4,297

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,554 parts In-Stock

1+ parts

$8.796

100+ parts

-

1k+ parts

$9.481

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1,554

$8.796

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$9.481

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DigiPath Technology Company

USA . 152 parts In-Stock

1+ parts

$9.685

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152

$9.685

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IDEA Electronic Components Group

UK . 739 parts In-Stock

1+ parts

$9.883

100+ parts

$9.389

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$8.895

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739

$9.883

$9.389

$8.895

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ChromeModa Solutions

Germany . 616 parts In-Stock

1+ parts

$9.883

100+ parts

$8.104

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616

$9.883

$8.104

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One Stop Electronics

USA . 255 parts In-Stock

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$16.000

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255

$16.000

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AZTECH Wire

Italy . 256 parts In-Stock

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$17.047

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Corphita

USA . 4,503 parts In-Stock

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Overview

Experience seamless and reliable signal routing with the Texas Instruments SN74ALS157ADRE4 multiplexer & demultiplexer. Designed with top-notch quality and precision by a trusted manufacturer, this versatile component offers unmatched performance in various applications. From data transmission to signal processing, this device delivers exceptional value and efficiency to customers. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 14 ns

Low propagation delay ensures fast data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

No. of Functions: 4

Having multiple functions in a single device increases efficiency and reduces the need for multiple components, leading to cost savings.

No. of Inputs: 2

With 2 inputs, this multiplexer/demultiplexer can handle multiple signals simultaneously, enhancing its versatility and usability.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration with other components easier and more compatible.

Load Capacitance (CL): 50 pF

Having a specified load capacitance helps in optimizing signal transmission and ensures proper functioning of the device.

Power Supplies (V): 5

Consistent power supply voltage of 5V ensures stable operation and reliable performance of the multiplexer/demultiplexer.

No. of Terminals: 16

Having 16 terminals allows for easy interfacing with external components, enabling seamless integration into existing systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and enables compact designs in applications where size is a constraint.

Maximum I (ol): 8 Amp

With a maximum output current of 8A, this multiplexer/demultiplexer can handle high power requirements, making it suitable for demanding applications.

Propagation Delay (tpd): 17 ns

With a short propagation delay of 17ns, this device ensures fast switching between input and output signals, enhancing overall performance.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70°C allows this product to withstand harsh environmental conditions and ensures reliable operation in various settings.

Minimum Operating Temperature: 0 °C

Capable of functioning at temperatures as low as 0°C, this multiplexer/demultiplexer is suitable for a wide range of operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold finish on terminals enhances conductivity, corrosion resistance, and reliability, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in mounting options and allows for efficient PCB layout in different configurations.

Maximum Seated Height: 1.75 mm

Low seated height of 1.75mm enables compact and slim designs, making this product suitable for space-constrained applications.

Width: 3.9 mm

Narrow width of 3.9mm helps in saving PCB real estate and allows for high-density board designs.

Output Polarity: TRUE

True output polarity ensures accurate signal processing and compatibility with other components, leading to reliable operation.

Minimum Supply Voltage (Vsup): 4.5 V

Having a minimum supply voltage of 4.5V ensures compatibility with a wide range of power sources and enhances flexibility in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, this product can withstand soldering processes, ensuring proper assembly and reliability.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of 260°C, making this product suitable for reflow soldering processes in manufacturing.

Length: 9.9 mm

Compact length of 9.9mm allows for efficient use of PCB space and contributes to overall size reduction in electronic systems.

Temperature Grade: COMMERCIAL

Commercial temperature grade enables operation in standard temperature ranges, making this product suitable for most commercial applications.

Technology: TTL

Utilizing TTL technology ensures compatibility with TTL logic levels and enhances interoperability with other TTL-based components.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and inspection during PCB assembly, ensuring reliable connections and robust performance.

Packing Method: TR

TR packing method provides convenient tape and reel packaging for automated assembly processes, improving production efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27mm allows for precise and compact terminal placement on the PCB, enhancing connectivity and reliability.

Maximum Supply Voltage (Vsup): 5.5 V

Having a maximum supply voltage of 5.5V ensures the device's robustness against voltage fluctuations and transient conditions, enhancing reliability.

Maximum Power Supply Current (ICC): 11 mA

With a maximum power supply current of 11mA, this product operates efficiently and conservatively in terms of power consumption, suitable for low-power applications.

Technical Specifications

Multiplexer & Demultiplexer SN74ALS157ADRE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

11 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexer

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74ALS157ADRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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