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74LVC157ABQ-Q100X

NXP Semiconductors

74LVC157ABQ-Q100X by NXP Semiconductors

NXP Semiconductors' 74LVC157ABQ-Q100X is a CMOS multiplexer with 4 functions, 2 inputs, and propagation delay of 6.5 ns at 3.3V. AEC-Q100 screened for automotive applications, it operates b/w -40 to 125 °C and has a max seated height of 1 mm.

Median Price

$0.141

Lifecycle Status

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8

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1k+

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Rochester

USA . 2,750 parts In-Stock

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Verical

USA . 2,750 parts In-Stock

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Digiode

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Nova Conductors

Japan . 80 parts In-Stock

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Semicontronic

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Corphita

USA . 585 parts In-Stock

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Argo Parts USA

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AZTECH Wire

Italy . 13,158 parts In-Stock

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Ampacity Inc.

Singapore . 2,602 parts In-Stock

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Microchip USA

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Corohmni

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Continental Prestige Electronics

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Netroflash

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Overview

Upgrade your automotive applications with the high-quality 74LVC157ABQ-Q100X multiplexer from NXP Semiconductors. With AEC-Q100 screening, this chip carrier offers reliable performance in extreme temperatures, ensuring durability and efficiency. Perfect for automotive electronics, this versatile component features low propagation delay and true output polarity for seamless integration. Trust NXP Semiconductors to deliver cutting-edge solutions for your multiplexing needs, providing value and innovation you can count on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to damage, ensuring a long lifespan.

Propagation Delay At Nominal Supply: 6.5 ns

The low propagation delay ensures fast signal processing, making this product suitable for applications that require high-speed data transmission.

Surface Mount: YES

The surface mount capability makes installation easy and allows for compact design, saving space in the circuit board.

No. of Functions: 4

With 4 functions in one component, this product offers versatility and efficiency in managing multiple inputs and outputs.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the product meets automotive industry standards for reliability and performance under harsh conditions.

No. of Inputs: 2

Having 2 inputs allows for flexibility in connecting multiple sources to the multiplexer/demultiplexer.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is a common standard in many electronic systems, ensuring compatibility with a wide range of applications.

Load Capacitance (CL): 50 pF

The low load capacitance reduces signal distortion and interference, improving the overall signal quality.

Power Supplies (V): 3.3

Operating at 3.3V provides a balance between power consumption and performance, making it suitable for various electronic devices.

No. of Terminals: 16

Having 16 terminals allows for easy connection to other components in the circuit, enhancing the flexibility and functionality of the product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer different mounting options and heat dissipation capabilities, making it adaptable to different system requirements.

Maximum I (ol): 24 Amp

The high output current capability of 24A ensures that the product can drive heavy loads without overheating or damage.

Propagation Delay (tpd): 11.8 ns

Although not the fastest, the propagation delay of 11.8ns is still relatively low, making it suitable for applications where speed is important but not critical.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the product to be used in environments with elevated temperatures without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the product can function reliably in cold environments or during temperature fluctuations.

Terminal Position: QUAD

With a quad terminal position, the product offers stable and secure connections, reducing the risk of signal loss or interference.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for slim and compact design, ideal for space-constrained applications.

Width: 2.5 mm

The narrow width of 2.5mm enables the product to be used in tight spaces or when a smaller footprint is required.

Output Polarity: TRUE

Having true output polarity ensures accurate signal representation, reducing errors and improving overall system performance.

Minimum Supply Voltage (Vsup): 1.2 V

The low minimum supply voltage of 1.2V allows the product to operate efficiently even in low-power applications, saving energy.

Length: 3.5 mm

The compact length of 3.5mm contributes to the overall small form factor of the product, making it suitable for applications with limited space.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the product can withstand the temperature variations and demands of automotive environments, making it reliable for automotive applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and improves signal integrity, reducing the risk of solder joint failures.

Packing Method: TR

The TR packing method provides protection during transportation and storage, ensuring that the product arrives in good condition to the end user.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5mm allows for fine-pitch connections, enabling high-density circuit design and saving space on the PCB.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage of 3.6V provides tolerance for voltage spikes or fluctuations, enhancing the product's robustness and reliability.

Technical Specifications

Multiplexer & Demultiplexer 74LVC157ABQ-Q100X attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PQCC-N16

Length:

3.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.1X.14,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

11.8 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

2.5 mm

Trade Compliance

74LVC157ABQ-Q100X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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