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M38510/30906B2X

Texas Instruments

M38510/30906B2X by Texas Instruments

M38510/30906B2X by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at a supply voltage range of 4.5V to 5.5V. It features a propagation delay of 39ns and operates in military-grade temperature ranges (-55°C to 125°C). This chip carrier package is ideal for applications requiring high-speed signal switching in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,780 parts In-Stock

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Anansix

USA . 633 parts In-Stock

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Digiode

USA . 633 parts In-Stock

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633

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AZTECH Wire

Italy . 352 parts In-Stock

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$13.355

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352

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Parana Technologies

USA . 988 parts In-Stock

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$20.585

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$20.678

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DigiPath Technology Company

USA . 1,251 parts In-Stock

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$22.666

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IDEA Electronic Components Group

UK . 2,362 parts In-Stock

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$23.129

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$21.973

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$20.816

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ChromeModa Solutions

Germany . 1,918 parts In-Stock

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$23.129

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$18.966

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One Stop Electronics

USA . 1,187 parts In-Stock

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$28.000

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Corphita

USA . 2,720 parts In-Stock

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Overview

Experience seamless and reliable performance with the M38510/30906B2X by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers superior quality products like this Multiplexer & Demultiplexer, suitable for a wide range of applications. With its advanced technology and military-grade screening level, this chip carrier offers 4 functions, fast propagation delay, and 3-state output characteristics. Trust in Texas Instruments to provide you with a high-performing solution that exceeds your expectations, making your projects run smoothly and efficiently.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material provides durability and reliability for the device, making it suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 4

Having 4 functions in one device increases versatility and functionality, making it a cost-effective solution for multiplexing and demultiplexing tasks.

Screening Level: MIL-M-38510 Class B

The MIL-M-38510 Class B screening level ensures high reliability and performance standards, making it suitable for military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a common standard in many electronic systems, ensuring compatibility and ease of integration.

Propagation Delay (tpd): 39 ns

The low propagation delay of 39 ns allows for fast data transmission, reducing latency and improving overall system performance.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this device can withstand high temperatures and harsh environments, enhancing its reliability and longevity.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer flexibility in controlling the output signals, allowing for high impedance state when not actively transmitting.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of TTL-based systems and devices, making it a versatile choice for integration.

Technical Specifications

Multiplexer & Demultiplexer M38510/30906B2X attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

39 ns

Qualification:

Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

M38510/30906B2X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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