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M38510/07903BFX

Texas Instruments

M38510/07903BFX by Texas Instruments

M38510/07903BFX by Texas Instruments is a MILITARY-grade Multiplexer & Demultiplexer with 4 functions, 2 inputs, and 7.5 ns propagation delay. It operates b/w -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V. Ideal for applications requiring fast signal switching in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 8,772 parts In-Stock

1+ parts

-

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1k+ parts

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8,772

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Vyrian

USA . 2,636 parts In-Stock

1+ parts

-

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2,636

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Anansix

USA . 841 parts In-Stock

1+ parts

-

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841

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,640 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

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1,640

$3.000

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AZTECH Wire

Italy . 429 parts In-Stock

1+ parts

$4.900

100+ parts

-

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429

$4.900

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Parana Technologies

USA . 785 parts In-Stock

1+ parts

$13.101

100+ parts

-

1k+ parts

$13.602

10k+ parts

-

785

$13.101

-

$13.602

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DigiPath Technology Company

USA . 777 parts In-Stock

1+ parts

$14.426

100+ parts

-

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777

$14.426

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IDEA Electronic Components Group

UK . 1,811 parts In-Stock

1+ parts

$14.720

100+ parts

$13.984

1k+ parts

$13.248

10k+ parts

-

1,811

$14.720

$13.984

$13.248

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ChromeModa Solutions

Germany . 844 parts In-Stock

1+ parts

$14.720

100+ parts

$12.070

1k+ parts

-

10k+ parts

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844

$14.720

$12.070

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UNI Independent Distributors

Spain . 7,591 parts In-Stock

1+ parts

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7,591

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Corphita

USA . 7,192 parts In-Stock

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7,192

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Overview

Experience unparalleled performance and reliability with the M38510/07903BFX from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality multiplexer & demultiplexer components that excel in a variety of applications. With advanced technology and a MILITARY-grade screening level, this product offers customers unmatched value, efficiency, and precision. Trust Texas Instruments to provide the solutions you need for your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the internal components of the product, ensuring reliable performance even in harsh environments.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 4

Ability to handle multiple functions simultaneously, making it versatile and efficient for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage, making it compatible with standard power sources.

Propagation Delay (tpd): 7.5 ns

Low propagation delay ensures fast data transmission, making it suitable for high-speed applications.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold temperatures, providing reliability in a wide range of environmental conditions.

Technology: TTL

Utilizes TTL technology for accurate and reliable data transfer, ensuring high performance in digital circuits.

Technical Specifications

Multiplexer & Demultiplexer M38510/07903BFX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-GDFP-F16

Length:

10.16 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT APPLICABLE

Propagation Delay (tpd):

7.5 ns

Qualification:

Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

6.73 mm

Trade Compliance

M38510/07903BFX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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